ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢇ ꢃ ꢂ ꢄꢈ ꢀꢁꢉ ꢃ ꢄ ꢅꢆ ꢇꢃ ꢂꢅ
ꢊ ꢋꢆꢄꢌ ꢅꢍꢀ ꢆ ꢎꢄꢁꢀ ꢋꢏ ꢐ ꢑꢏ ꢎ ꢀ
ꢒ ꢐꢆ ꢓ ꢔ ꢕꢀꢆꢄꢆ ꢏ ꢊ ꢍꢆ ꢖꢍ ꢆꢀ
SCBS081L − JANUARY 1991 − REVISED APRIL 2005
D
D
D
Typical V
(Output Ground Bounce)
D
D
Latch-Up Performance Exceeds 500 mA Per
JEDEC Standard JESD 17
OLP
<1 V at V
= 5 V, T = 25°C
CC
A
I
and Power-Up 3-State Support Hot
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
off
Insertion
High-Drive Outputs (−32-mA I , 64-mA I
OH
)
OL
SN54ABT245A . . . J OR W PACKAGE
SN74ABT245B . . . DB, DGV, DW, N, NS,
OR PW PACKAGE
SN54ABT245B . . . FK PACKAGE
(TOP VIEW)
SN74ABT245B . . . RGY PACKAGE
(TOP VIEW)
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1
20
DIR
A1
V
CC
3
2
1 20 19
18
B1
B2
B3
19
18
17
16
15
14
13
12
A3
A4
A5
A6
A7
4
5
6
7
8
2
3
4
5
6
7
8
9
OE
B1
B2
B3
B4
B5
B6
B7
B8
A1
A2
A3
A4
A5
A6
A7
A8
OE
B1
B2
B3
B4
B5
B6
B7
17
16
A2
A3
15 B4
14
A4
B5
A5
9 10 11 12 13
A6
A7
A8
10
11
GND
description/ordering information
These octal bus transceivers are designed for asynchronous communication between data buses. The devices
transmit data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are
effectively isolated.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube
SN74ABT245BN
SN74ABT245BN
AB245B
QFN − RGY
Tape and reel SN74ABT245BRGYR
Tube SN74ABT245BDW
SOIC − DW
ABT245B
Tape and reel SN74ABT245BDWR
Tape and reel SN74ABT245BNSR
Tape and reel SN74ABT245BDBR
SOP − NS
ABT245B
AB245B
SSOP − DB
−40°C to 85°C
Tube
SN74ABT245BPW
TSSOP − PW
TVSOP − DGV
AB245B
AB245B
Tape and reel SN74ABT245BPWR
Tape and reel SN74ABT245BDGVR
SN74ABT245BGQNR
VFBGA − GQN
VFBGA − ZQN (Pb-free)
CDIP − J
Tape and reel
AB245B
SN74ABT245BZQNR
Tube
Tube
Tube
SNJ54ABT245AJ
SNJ54ABT245AW
SNJ54ABT245AFK
SNJ54ABT245AJ
SNJ54ABT245AW
SNJ54ABT245AFK
CFP − W
−55°C to 125°C
LCCC − FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2005, Texas Instruments Incorporated
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