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SN54ABT2244J PDF预览

SN54ABT2244J

更新时间： 2024-11-13 23:06:07
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路输出元件信息通信管理
页数 文件大小 规格书
7页 107K
描述
OCTAL BUFFERS AND LINE/MOS DRIVERS WITH 3-STATE OUTPUTS

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SN54ABT2244J 技术参数

是否Rohs认证：不符合生命周期：Obsolete
零件包装代码：DIP包装说明：CERAMIC, DIP-20
针数：20Reach Compliance Code：not_compliant
ECCN代码：3A001.A.2.CHTS代码：8542.39.00.01
风险等级：5.76Is Samacsys：N
其他特性：TYP VOLP < 1V @ VCC = 5V, TA = 25 DEG C; 25 OHM OUTPUT SERIES RESISTOR控制类型：ENABLE LOW
系列：ABTJESD-30 代码：R-GDIP-T20
长度：24.195 mm负载电容（CL）：50 pF
逻辑集成电路类型：BUS DRIVER最大I（ol）：0.012 A
位数：4功能数量：2
端口数量：2端子数量：20
最高工作温度：125 °C最低工作温度：-55 °C
输出特性：3-STATE WITH SERIES RESISTOR输出极性：TRUE
封装主体材料：CERAMIC, GLASS-SEALED封装代码：DIP
封装等效代码：DIP20,.3封装形状：RECTANGULAR
封装形式：IN-LINE峰值回流温度（摄氏度）：NOT SPECIFIED
电源：5 V最大电源电流（ICC）：30 mA
传播延迟（tpd）：6.8 ns认证状态：Not Qualified
座面最大高度：5.08 mm子类别：Bus Driver/Transceivers
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：4.5 V
标称供电电压 (Vsup)：5 V表面贴装：NO
技术：BICMOS温度等级：MILITARY
端子形式：THROUGH-HOLE端子节距：2.54 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：7.62 mmBase Number Matches：1

SN54ABT2244J 数据手册

 浏览型号SN54ABT2244J的Datasheet PDF文件第2页浏览型号SN54ABT2244J的Datasheet PDF文件第3页浏览型号SN54ABT2244J的Datasheet PDF文件第4页浏览型号SN54ABT2244J的Datasheet PDF文件第5页浏览型号SN54ABT2244J的Datasheet PDF文件第6页浏览型号SN54ABT2244J的Datasheet PDF文件第7页 
SN54ABT2244, SN74ABT2244  
OCTAL BUFFERS AND LINE/MOS DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS106B – JANUARY 1991 – REVISED JULY 1994  
SN54ABT2244 . . . J PACKAGE  
SN74ABT2244 . . . DB, DW, N, OR PW PACKAGE  
(TOP VIEW)  
• Output Ports Have Equivalent 25-Ω Series  
Resistors, So No External Resistors Are  
Required  
• State-of-the-Art EPIC-ΙΙB BiCMOS Design  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
V
CC  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
Significantly Reduces Power Dissipation  
2OE  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
2A2  
1Y4  
2A1  
• Typical V  
(Output Ground Bounce)  
OLP  
CC  
< 1 V at V  
= 5 V, T = 25°C  
A
• Package Options Include Plastic  
Small-Outline (DW), Shrink Small-Outline  
(DB), and Thin Shrink Small-Outline (PW)  
Packages, Ceramic Chip Carriers (FK), and  
Plastic (N) and Ceramic (J) DIPs  
description  
SN54ABT2244 . . . FK PACKAGE  
(TOP VIEW)  
These octal buffers and line drivers are designed  
specifically to improve both the performance and  
density of 3-state memory address drivers, clock  
drivers, and bus-oriented receivers and  
transmitters. Taken together with the ′ABT2240  
and ′ABT2241, these devices provide the choice  
of selected combinations of inverting and  
noninverting outputs, symmetrical active-low  
output-enable (OE) inputs, and complementary  
OE and OE inputs. These devices feature high  
fan-out and improved fan-in.  
3
2
1
20 19  
18  
4
5
6
7
8
1Y1  
2A4  
1Y2  
2A3  
1Y3  
1A2  
2Y3  
1A3  
2Y2  
1A4  
17  
16  
15  
14  
9 10 11 12 13  
The outputs, which are designed to sink up to  
12 mA, include 25-Ω series resistors to reduce  
overshoot and undershoot.  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
The SN74ABT2244 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count  
and functionality of standard small-outline packages in less than half the printed-circuit-board area.  
The SN54ABT2244 is characterized for operation over the full military temperature range of –55°C to 125°C.  
The SN74ABT2244 is characterized for operation from –40°C to 85°C.  
FUNCTION TABLE  
(each buffer)  
INPUTS  
OUTPUT  
Y
A
OE  
L
H
L
H
L
L
H
X
Z
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.  
Copyright 1994, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
6–1  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567

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