MBD701,
MMBD701L,
SMMBD701L
Preferred Device
Silicon Hot-Carrier Diodes
Schottky Barrier Diodes
http://onsemi.com
These devices are designed primarily for high−efficiency UHF and
VHF detector applications. They are readily adaptable to many other
fast switching RF and digital applications. They are supplied in an
inexpensive plastic package for low−cost, high−volume consumer
and industrial/commercial requirements. They are also available in a
Surface Mount package.
TO−92 2−Lead
CASE 182
STYLE 1
SOT−23 (TO−236)
CASE 318
Features
Extremely Low Minority Carrier Lifetime − 15 ps (Typ)
STYLE 8
Very Low Capacitance − 1.0 pF @ V = 20 V
R
TO−92
SOT−23
High Reverse Voltage − to 70 V
Low Reverse Leakage − 200 nA (Max)
AEC Qualified and PPAP Capable
2
1
3
1
CATHODE
ANODE CATHODE
ANODE
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
MARKING DIAGRAMS
Pb−Free Packages are Available*
MBD
701
AYWW G
G
5H M G
MAXIMUM RATINGS
G
Rating
Reverse Voltage
Symbol
Value
Unit
1
V
R
70
V
Forward Power Dissipation
P
F
TO−92
SOT−23
@ T = 25C
mW
A
MBD701
280
200
A
Y
= Assembly Location
= Year
MMBD701L, SMMBD701L
WW = Work Week
5H = Device Code (SOT−23)
Derate above 25C
MBD701
mW/C
2.8
2.0
M
= Date Code*
MMBD701L, SMMBD701L
G
= Pb−Free Package
Operating Junction Temperature
Range
T
−55 to +125
C
C
J
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may vary
dependingupon manufacturing location.
Storage Temperature Range
T
stg
−55 to +150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
RecommendedOperating Conditions may affect device reliability.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
downloadthe ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
November, 2011 − Rev. 6
MBD701/D