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SMMBD701L PDF预览

SMMBD701L

更新时间: 2022-02-26 13:00:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 94K
描述
Silicon Hot-Carrier Diodes

SMMBD701L 数据手册

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MBD701,  
MMBD701L,  
SMMBD701L  
Silicon Hot-Carrier Diodes  
Schottky Barrier Diodes  
www.onsemi.com  
These devices are designed primarily for high−efficiency UHF and  
VHF detector applications. They are readily adaptable to many other  
fast switching RF and digital applications. They are supplied in an  
inexpensive plastic package for low−cost, high−volume consumer  
and industrial/commercial requirements. They are also available in a  
Surface Mount package.  
TO−92 2−Lead  
CASE 182  
STYLE 1  
SOT−23 (TO−236)  
CASE 318  
Features  
Extremely Low Minority Carrier Lifetime − 15 ps (Typ)  
STYLE 8  
Very Low Capacitance − 1.0 pF @ V = 20 V  
R
TO−92  
SOT−23  
High Reverse Voltage − to 70 V  
2
1
3
1
Low Reverse Leakage − 200 nA (Max)  
CATHODE  
ANODE CATHODE  
ANODE  
S Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC Qualified and PPAP  
Capable  
MARKING DIAGRAMS  
These Devices are Pb−Free and are RoHS Compliant  
MBD  
701  
AYW G  
G
MAXIMUM RATINGS  
5H M G  
G
Rating  
Reverse Voltage  
Symbol  
Value  
Unit  
1
V
R
70  
V
Forward Power Dissipation  
P
F
TO−92  
SOT−23  
@ T = 25°C  
mW  
A
MBD701  
280  
200  
A
Y
= Assembly Location  
= Year  
MMBD701L, SMMBD701L  
W
= Work Week  
Derate above 25°C  
MBD701  
MMBD701L, SMMBD701L  
mW/°C  
5H = Device Code (SOT−23)  
M
2.8  
2.0  
= Date Code*  
= Pb−Free Package  
G
Operating Junction Temperature  
Range  
T
−55 to +125  
°C  
°C  
J
(Note: Microdot may be in either location)  
*Date Code orientation and/or overbar may vary  
dependingupon manufacturing location.  
Storage Temperature Range  
T
stg  
−55 to +150  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
©
Semiconductor Components Industries, LLC, 1994  
1
Publication Order Number:  
October, 2016 − Rev. 7  
MBD701/D  

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