SMM30

更新时间： 2024-01-17 02:31:42

品牌	Logo	应用领域
BEL		电熔丝电路保护
页数	文件大小	规格书
2页	362K
描述
Square Ceramic Surface Mount Medium Blow Fuse

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SMM30 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	包装说明：	HALOGEN FREE AND ROHS COMPLIANT
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8536.10.00.40	风险等级：	5.53
Is Samacsys：	N	其他特性：	PRE-ARCING TIME: OPEN WITHIN 60 SEC. AT 200% RATED CURRENT, RATED BREAKING CAPACITY AT 65VDC: 300A
熔断特性：	MEDIUM	主体宽度：	3.05 mm
主体高度：	3.05 mm	主体长度或直径：	9.8 mm
电路保护类型：	ELECTRIC FUSE	保险丝尺寸：	3912
JESD-609代码：	e3	焦耳积分标称：	1000 J
安装特点：	SURFACE MOUNT	最高工作温度：	125 °C
最低工作温度：	-55 °C	包装方法：	TR
物理尺寸：	9.8mm x 3.05mm x 3.05mm	额定分断能力：	100 A
额定电流：	30 A	额定电压：	250 V
额定电压（交流）：	250 V	额定电压（直流）：	65 V
参考标准：	CE; CUL; UL	表面贴装：	YES
端子面层：	Matte Tin (Sn)	端子形状：	WRAPAROUND
Base Number Matches：	1

SMM30 数据手册

3812 Size

Type SMM

Square Ceramic Surface Mount Medium Blow Fuse

RoHS6 Compliant

SMMD Sept.,2010

Catalog Ampere Typical Cold Volt-drop

Number Rating Resistance @100% In

Melting I²t

@10In

Maximum

Power

Dissipation

(W)

(ohm)

(Volt) max. (A²Sec) min.

SMM 20

SMM 25

SMM 30

20A

25A

30A

0.0025

0.0019

0.0013

0.09

0.08

0.07

270

420

1.8

2.0

2.1

1000

Consult manufacturer for other ratings

Electrical Characteristics

Blow Time

Maximum

Testing Current

Minimum

4 hrs

100%

200%

N/A

60 sec

Approvals

Amp range / I.R. ability @ Volt

Safety Agency Approvals

20A - 30A / 100A@ 250V AC resistive

150A@125V AC resistive

300A@ 65V DC resistive

Recognized File No. E20624

Physical Specification

Materials

Ceramic Body / Matte Tin Plated Brass Caps

Soldering Guidelines

Reflow Conditions Recommended: 240°C, 30 sec. max.

Marking

On fuse:

Pb-Free Process Compatibility:

When soldered to test boards using IR reflow in accordance with JEDEC

"bel", "Current Rating" in black

J-STD-020 (260°C, 40 sec. max.), SMM samples exhibited DCR change of

+10% to -20% from initial values.

'On label:

"bel", "SMM", Current Rating, Voltage Rating, Interrupting Rating,

Safety Logo and " "," "(China RoHS compliant)

Subsequent tests showed all samples complied with the stated electrical

characteristics on this data sheet.

NOT Recommended for Wave solder / Direct immersion / Hand Solder

Packaging

Environmental Specification

2,000 fuses in 13 inches dia. reel, 16mm wide tape, 8mm pitch, per EIA Standard

481

Shock Resistance

MIL-STD-202G, Method 213B, Test Condition I (100 G's peak for 6 milliseconds).

Mechanical Dimensions

Vibration Resistance

2.0 0.2mm

3.1 0.1mm

MIL-STD-202G, Method 201A (10-55 Hz, 0.06 inch, total excursion).

(0.08'' 0.008'')

(0.12'' 0.004'')

Salt Spray Resistance

3.1 0.1mm

(0.12'' 0.004'')

MIL-STD-202G, Method 101E, Test condition B (48 hrs).

Thermal Shock Resistance

9.8 0.2mm

MIL-STD-202G, Method 107G, Test Condition B (-65°C to +125°C)

(0.39'' 0.008'')

3.8mm

(0.15")

Insulation Resistance:

MIL-STD-202G, Method 302, Test Condition A

(After Opening) 10,000 ohms minimum

Solderability:

4.1mm

(0.16")

MIL-STD-202G, Method 208H

Soldering Heat Resistance:

MIL-STD-202G, Method 210F

Operating Temperature

5.6mm

(0.22")

-55°C to +85°C Max.

NOTES:

– TEST CONDITIONS

For all SMM data, as well as UL Component investigation, all tests were conducted with fuse samples soldered on a PCB (1.6mm thick) test

board with copper traces measuring 0.1 mm nominal thickness (3 oz.clad), 10mm wide and 100 mm overall length.

– UL Condition of Acceptability

- the following information is contained in the UL Component Recognition for SMM Fuse Series:

The maximum temperature recorded in open air was 100 ^oC in a 21 ^oC ambient (79 ^oC rise). Consideration should be given to checking

operating temperatures in end-use application with regard to thermal index of surrounding materials and components.

(Maximum temperature recorded at 80% of rating (24A) for the SMM30 rating was 69 C (48 C rise).

CAUTION:

– MINIMUM FUSING POINT :

The SMM Series fuses are NOT intended to be operated at currents between 100% and 200% of ampere rating. Prolonged operation at currents

in this range may result in overheating of the fuse and/or desoldering of the fuse caps from the PCB pad.

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