SMG2322N
2.5A, 30V, RDS(ON) 85 m
N-Channel Enhancement MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen & lead-free
DESCRIPTION
SC-59
These miniature surface mount MOSFETs utilize a
high cell density trench process to provide low RDS(on)
and to ensure minimal power loss and heat dissipation.
A
L
3
3
Top View
C B
1
1
2
FEATURES
2
K
F
E
Low RDS(on) provides higher efficiency and extends
battery life.
D
Low thermal impedance copper leadframe SC-59
saves board space.
H
J
G
Fast switching speed.
High performance trench technology.
Millimeter
Min. Max.
Millimeter
Min. Max.
0.10 REF.
0.40 REF.
REF.
REF.
A
B
C
D
2.70
2.25
1.30
1.00
3.10
3.00
1.70
1.40
G
H
J
0.10
0.20
APPLICATION
K
0.45
0.55
E
F
1.70
0.35
2.30
0.50
L
0.85
1.15
DC-DC converters and power management in portable
and battery-powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
PACKAGE INFORMATION
Package
MPQ
LeaderSize
SC-59
3K
7’ inch
ABSOLUTE MAXIMUM RATINGS(TA=25°C unless otherwise specified)
Parameter
Symbol
Rating
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
30
±20
2.5
V
V
TA=25°C
TA=70°C
Continuous Drain Current 1
ID
A
2
Pulsed Drain Current 2
IDM
IS
10
A
A
Continuous Source Current (Diode Conduction) 1
TA=25°C
TA=70°C
Operating Junction and Storage Temperature Range
0.46
1.25
0.8
Power Dissipation 1
PD
W
TJ, TSTG
-55~150
°C
Thermal Resistance Rating
t≦5 sec
RθJA
150
200
Maximum Junction to Ambient 1
°C/W
Steady-State
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
12-Apr-2011 Rev. B
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