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SMG2306N PDF预览

SMG2306N

更新时间: 2024-09-29 09:19:07
品牌 Logo 应用领域
SECOS /
页数 文件大小 规格书
4页 560K
描述
N-Channel Enhancement Mode Mos.FET

SMG2306N 数据手册

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SMG2306N  
3.5A , 30V , RDS(ON) 58 m  
N-Channel Enhancement Mode Mos.FET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen and lead-free  
DESCRIPTION  
SC-59  
These miniature surface mount MOSFETs utilize  
High Cell Density process. Low RDS(on) assures minimal  
power loss and conserves energy, making this device  
ideal for use in power management circuitry.  
A
L
3
3
Top View  
C B  
1
1
2
FEATURES  
2
K
F
E
Low RDS(on) provides higher efficiency and  
extends battery life.  
D
Low gate charge  
Fast switching  
Miniature SC-59 surface mount package  
saves board space.  
H
J
G
Millimeter  
Millimeter  
Min. Max.  
0.10 REF.  
0.40 REF.  
0.10  
0.45  
REF.  
REF.  
Min.  
Max.  
3.10  
3.00  
1.70  
1.40  
A
B
C
D
2.70  
2.25  
1.30  
1.00  
G
H
J
APPLICATION  
0.20  
0.55  
K
PWMDC-DC converters, power management  
E
F
1.70  
0.35  
2.30  
0.50  
L
0.85  
1.15  
in portable and battery-powered products such as  
computers, printers, battery charger, telecommunication  
power system, and telephones power system.  
PACKAGE INFORMATION  
Package  
MPQ  
LeaderSize  
SC-59  
3K  
7’ inch  
ABSOLUTE MAXIMUM RATINGS(TA=25°C unless otherwise specified)  
Parameter  
Symbol  
Rating  
30  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
V
V
±20  
3.5  
ID @ TA=25°C  
ID @ TA=70°C  
A
Continuous Drain Current 1  
ID  
2.8  
A
Pulsed Drain Current 2  
IDM  
IS  
A
16  
Continuous Source Current (Diode Conduction) 1  
Power Dissipation 1  
1.25  
1.3  
A
PD @ TA=25°C  
PD @ TA=70°C  
W
W
°C  
PD  
0.8  
Operating Junction and Storage Temperature Range  
Tj, Tstg  
-55 ~ 150  
Thermal Resistance Rating  
t 10 sec  
100  
166  
Maximum Junction to Ambient 1  
Notes:  
RJA  
°C / W  
Steady State  
1
2
Surface Mounted on 1” x 1” FR4 Board.  
Pulse width limited by maximum junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
12-Apr-2011 Rev. B  
Page 1 of 4  

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