SMG2306N
3.5A , 30V , RDS(ON) 58 m
N-Channel Enhancement Mode Mos.FET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
DESCRIPTION
SC-59
These miniature surface mount MOSFETs utilize
High Cell Density process. Low RDS(on) assures minimal
power loss and conserves energy, making this device
ideal for use in power management circuitry.
A
L
3
3
Top View
C B
1
1
2
FEATURES
2
K
F
E
Low RDS(on) provides higher efficiency and
extends battery life.
D
Low gate charge
Fast switching
Miniature SC-59 surface mount package
saves board space.
H
J
G
Millimeter
Millimeter
Min. Max.
0.10 REF.
0.40 REF.
0.10
0.45
REF.
REF.
Min.
Max.
3.10
3.00
1.70
1.40
A
B
C
D
2.70
2.25
1.30
1.00
G
H
J
APPLICATION
0.20
0.55
K
PWMDC-DC converters, power management
E
F
1.70
0.35
2.30
0.50
L
0.85
1.15
in portable and battery-powered products such as
computers, printers, battery charger, telecommunication
power system, and telephones power system.
PACKAGE INFORMATION
Package
MPQ
LeaderSize
SC-59
3K
7’ inch
ABSOLUTE MAXIMUM RATINGS(TA=25°C unless otherwise specified)
Parameter
Symbol
Rating
30
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
V
V
±20
3.5
ID @ TA=25°C
ID @ TA=70°C
A
Continuous Drain Current 1
ID
2.8
A
Pulsed Drain Current 2
IDM
IS
A
16
Continuous Source Current (Diode Conduction) 1
Power Dissipation 1
1.25
1.3
A
PD @ TA=25°C
PD @ TA=70°C
W
W
°C
PD
0.8
Operating Junction and Storage Temperature Range
Tj, Tstg
-55 ~ 150
Thermal Resistance Rating
t ≦ 10 sec
100
166
Maximum Junction to Ambient 1
Notes:
RJA
°C / W
Steady State
1
2
Surface Mounted on 1” x 1” FR4 Board.
Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
12-Apr-2011 Rev. B
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