SMF5.0A to SMF51A
VISHAY
Vishay Semiconductors
Surface Mount ESD Protection Diodes
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Features
• For surface mounted applications
• Low-profile package
• Optimized for LAN protection applications
• Ideal for ESD protection of data lines in
accordance with IEC 1000-4-2 (IEC801-2)
• Ideal for EFT protection of data lines in
accordance with IEC 1000-4-4 (IEC801-4)
• IEC 1000-4-2 (ESD) 15 kV (air) 8 kV (contact)
IEC 1000-4-4 (EFT) 40 A (tp = 5/ 50 ns)
IEC 1000-4-5 (Lightning) 24 A (tp = 8/ 20 µs)
• Low incremental surge resistance, excellent
clamping capability
Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026
• 200 W peak pulse power capability with a
10/1000 µs waveform, repetition rate
(duty cycle): 0.01 %
Polarity:The band denotes the cathode, which is
positive with respect to the anode under normal
TVS operation
• Very fast response time
Mounting Position: Any
• High temperature soldering guaranteed:
260 °C/ 10 seconds at terminals
Weight: approx. 0.00035 oz, 0.01g
Packaging Codes/Options:
G1/10 K per 13 " reel (8 mm tape), 50 K/box
G2/3 K per 7 " reel (8 mm tape), 30 K/box
Mechanical Data
Case: JEDEC DO-219-AB (SMF) Plastic case
Absolute Maximum Ratings
Ratings at 25 °C, ambient temperature unless otherwise specified
Parameter
Test condition
Symbol
PPPM
Value
200
Unit
W
10/1000 µs waveform1)
8/20 µs waveform1)
10/1000 µs waveform1)
Peak pulse power dissipation
PPPM
IPPM
1000
W
A
Peak pulse current
next
Table
Peak forward surge current
8.3 ms single half sine-wave
IFSM
20
A
1) Non-repetitive current pulse and derated above TA = 25 °C
Maximum Thermal Resistance
Ratings at 25 °C, ambient temperature unless otherwise specified
Parameter
Symbol
RthJA
Value
Unit
K/W
Thermal resistance2)
180
Operation junction and storage
temperature range
Tstg, TJ
- 55 to + 150
°C
2) Mounted on epoxy substrate with 3 x 3 mm, cu pads (≥ 40 µm thick)
Document Number 85811
Rev. 3, 21-Feb-03
www.vishay.com
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