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SMF307C PDF预览

SMF307C

更新时间: 2024-09-25 12:56:59
品牌 Logo 应用领域
森美特 - SUNMATE /
页数 文件大小 规格书
2页 308K
描述
3A patch fast recovery diode 1000V SMC series

SMF307C 数据手册

 浏览型号SMF307C的Datasheet PDF文件第2页 
SMF301C - SMF307C  
SURFACE MOUNT FAST RECOVERY RECTIFIER DIODES  
VOLTAGE RANGE: 50-1000V  
CURRENT: 3.0 A  
Features  
Glass Passivated Die Construction  
Fast Recovery Time for High Efficiency  
Low Forward Voltage Drop and High Current  
Capability  
!
!
!
Ideally Suited for Automatic Assembly  
Plastic Material: UL Flammability  
Classification Rating 94V-0  
!
!
B
SMC/DO-214AB  
Dim  
A
Min  
5.59  
6.60  
2.75  
0.15  
7.75  
0.10  
0.76  
2.00  
Max  
6.22  
7.11  
3.18  
0.31  
8.13  
0.20  
1.52  
2.62  
Mechanical Data  
A
J
C
B
!
!
Case: SMC/DO-214AB, Molded Plastic  
Terminals: Solder Plated, Solderable  
per MIL-STD-750, Method 2026  
Polarity: Cathode Band or Cathode Notch  
Marking: Type Number  
C
D
D
!
!
!
E
G
H
Weight: 0.21 grams (approx.)  
G
H
E
J
All Dimensions in mm  
Maximum Ratings and Electrical Characteristics  
TA = 25C unless otherwise specified  
For capacitive load, derate current by 20%.  
Single phase, half wave, 60Hz, resistive or inductive load.  
Symbol  
SMF301CSMF302C SMF303C SMF304C SMF305CSMF306C SMF307C  
Characteristic  
Unit  
VRRM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
50  
35  
100  
70  
200  
140  
400  
280  
600  
420  
800  
560  
1000  
700  
V
VR(RMS)  
IO  
RMS Reverse Voltage  
V
A
= 75C  
@ TT  
3.0  
Average Rectified Output Current  
Non-Repetitive Peak Forward Surge Current  
IFSM  
8.3ms Single half sine-wave Superimposed on Rated Load  
(JEDEC Method)  
100  
A
V
Forward Voltage  
@ I  
F = 3.0A  
VFM  
IRM  
trr  
1.3  
5.0  
250  
Peak Reverse Current  
at Rated DC Blocking Voltage  
@ TA = 25C  
@ TA = 125C  
A  
150  
250  
500  
ns  
Maximum Recovery Time (Note 3)  
Cj  
Typical Junction Capacitance (Note 2)  
50  
25  
pF  
RJT  
Typical Thermal Resistance Junction to Terminal (Note 1)  
Operating and Storage Temperature Range  
K/W  
Tj, TSTG  
-65 to +150  
C  
Notes:  
1. Thermal resistance: junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pad as heat sink.  
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.  
3. Reverse recovery test conditions: IF = 0.5A, IR = 1.0A, Irr = 0.25A. See figure 5.  
1 of 2  
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