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SMF3.3

更新时间: 2024-01-01 03:09:23
品牌 Logo 应用领域
商升特 - SEMTECH 电视光电二极管
页数 文件大小 规格书
7页 155K
描述
3.3 Volt TVS Array For ESD and Latch-Up Protection The SMF series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage-induced transient events. Each device will protect up to four lines operating at 3.3 volts. The SMF3.3 is a solid-state devices designed specifically for transient suppression. It is is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over traditional pn junction processes. They offer desirable characteristics for board level protection including fast response time, low clamping voltage and no device degradation. The SMF3.3 may be used to meet the immunity requirements of IEC 61000-4-2, level 4 (15kV air, 8kV contact discharge). The small SC70-5L package makes them ideal for use in portable electronics such as cell phones, PDA’s, and notebook computers.

SMF3.3 技术参数

生命周期:ObsoleteReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.84最大钳位电压:5.5 V
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE极性:UNIDIRECTIONAL
最大重复峰值反向电压:3.3 V子类别:Transient Suppressors
表面贴装:YESBase Number Matches:1

SMF3.3 数据手册

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SMF3.3  
3.3 Volt TVS Array  
For ESD and Latch-Up Protection  
PRELIMINARY  
PROTECTION PRODUCTS  
Features  
Description  
The SMF series of TVS arrays are designed to protect  
sensitive electronics from damage or latch-up due to  
ESD, lightning, and other voltage-induced transient  
events. Each device will protect up to four lines operat-  
ing at 3.3 volts.  
‹ ESD protection for data lines to  
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)  
‹ Small package for use in portable electronics  
‹ Protects four I/O lines  
‹ Working voltage: 3.3V  
‹ Low leakage current  
‹ Low operating and clamping voltages  
‹ Solid-state EPD TVS technology  
The SMF3.3 is a solid-state devices designed specifi-  
cally for transient suppression. It is is constructed  
using Semtech’s proprietary EPD process technology.  
The EPD process provides low standoff voltages with  
significant reductions in leakage currents and capaci-  
tance over traditional pn junction processes. They offer  
desirable characteristics for board level protection  
including fast response time, low clamping voltage and  
no device degradation.  
Mechanical Characteristics  
‹ EIAJ SC70-5L package  
‹ Molding compound flammability rating: UL 94V-0  
‹ Marking : Marking Code  
‹ Packaging : Tape and Reel per EIA 481  
Applications  
The SMF3.3 may be used to meet the immunity re-  
quirements of IEC 61000-4-2, level 4 (15kV air, 8kV  
contact discharge). The small SC70-5L package  
makes them ideal for use in portable electronics such  
as cell phones, PDA’s, and notebook computers.  
‹ Cellular Handsets & Accessories  
‹ Cordless Phones  
‹ Personal Digital Assistants (PDA’s)  
‹ Notebooks & Handhelds  
‹ Portable Instrumentation  
‹ Digital Cameras  
‹ Peripherals  
‹ MP3 Players  
Circuit Diagram  
Schematic & PIN Configuration  
1
3
4
5
1
2
3
5
4
2
SC70-5L (Top View)  
www.semtech.com  
Revision 02/07/2002  
1

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