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SMF05T1 PDF预览

SMF05T1

更新时间: 2024-02-05 16:16:27
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 127K
描述
Quad Array for ESD Protection

SMF05T1 技术参数

是否无铅:不含铅生命周期:Active
零件包装代码:SC-70包装说明:R-PDSO-G5
针数:5Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
Factory Lead Time:7 weeks风险等级:1.11
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:227096Samacsys Pin Count:5
Samacsys Part Category:DiodeSamacsys Package Category:SOT23 (5-Pin)
Samacsys Footprint Name:SC-88A SOT-353 CASE 419A-02Samacsys Released Date:2015-09-10 18:23:10
Is Samacsys:N最大击穿电压:7.2 V
最小击穿电压:6 V击穿电压标称值:6.6 V
最大钳位电压:12.5 V配置:COMMON ANODE, 4 ELEMENTS
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码:R-PDSO-G5JESD-609代码:e3
湿度敏感等级:1最大非重复峰值反向功率耗散:200 W
元件数量:4端子数量:5
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL认证状态:Not Qualified
最大重复峰值反向电压:5 V子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
Base Number Matches:1

SMF05T1 数据手册

 浏览型号SMF05T1的Datasheet PDF文件第2页浏览型号SMF05T1的Datasheet PDF文件第3页浏览型号SMF05T1的Datasheet PDF文件第4页 
SMF05T1  
Quad Array for  
ESD Protection  
This quad monolithic silicon voltage suppressor is designed for  
applications requiring transient overvoltage protection capability. It is  
intended for use in voltage and ESD sensitive equipment such as  
computers, printers, business machines, communication systems,  
medical equipment, and other applications. Its quad junction common  
anode design protects four separate lines using only one package.  
These devices are ideal for situations where board space is at a  
premium.  
http://onsemi.com  
MARKING  
DIAGRAM  
4
5
Specification Features  
60 MG  
SC88A Package Allows Four Separate Unidirectional Configurations  
Low Leakage < 5 mA @ 5 Volt  
Breakdown Voltage: 6.1 Volt -- 7.2 Volt @ 1 mA  
Low Capacitance (90 pF typical)  
ESD Protection Meeting IEC61000--4--2  
Pb--Free Packages are Available  
SC--88A/SOT--323  
CASE 419A  
STYLE 5  
G
1
2
3
60  
M
G
= Device Marking  
= One Digit Date Code  
= Pb--Free Package  
(Note: Microdot may be in either location)  
Mechanical Characteristics  
Void Free, Transfer--Molded, Thermosetting Plastic Case  
Corrosion Resistant Finish, Easily Solderable  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
5
4
1
2
3
Cathode  
Anode  
Cathode  
Cathode  
Cathode  
ORDERING INFORMATION  
Device  
Package  
Shipping  
SMF05T1  
SC--88A  
3000/Tape & Reel  
3000/Tape & Reel  
SMF05T1G  
SC--88A  
(Pb--Free)  
SMF05T2G  
SC--88A  
3000/Tape & Reel  
(Pb--Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
*For additional information on our Pb--Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 -- Rev. 3  
SMF05T1/D  

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