TVS Diodes
Surface Mount – 3000W > SMDJ series
Pb e3
RoHS
SMDJ Series
Description
Uni-directional
The SMDJ series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
• 3000W PPPM capability
at 10/1000μs waveform,
repetition rate (duty
cycles):0.01%
• Low incremental
surge resistance
• Typical IR less than 2μA when
VBR min>12V
Bi-directional
• For surface mounted
applications in order to
optimize board space
• High temperature to reflow
soldering guaranteed:
260°C/30sec
• VBR @TJ= VBR@25°C x (1+αT
x (TJ - 25))(αT:Temperature
Coefficient, typical
Agency Approvals
Agency
• Low profile package
Agency File Number
E230531
• Typical failure mode is short
from over-specified voltage or
current
value is 0.1%)
• Whisker test is conducted
based on JEDEC JESD201A
per its table 4a and 4c
• UL Recognized compound
meeting flammability rating
V-0
Maximum Ratings andThermal Characteristics
(TA=25OC unless otherwise noted)
• IEC-61000-4-2 ESD 30kV(Air), • Meet MSL level1, per
Parameter
Symbol
Value
Unit
30kV (Contact)
• ESD protection of data lines
in accordance with
J-STD-020, LF maximun peak
of 260°C
Peak Pulse Power Dissipation(Fig.2)
by 10/1000usTest Waveform(Fig.4) (Note
1),(Note 2) -Single Die Parts
PPPM
3000
W
• Matte tin lead–free plated
IEC 61000-4-2
• EFT protection of data lines in
accordance with
IEC 61000-4-4
• Built-in strain relief
• Halogen free and
RoHS compliant
• Pb-free E3 means 2nd level
interconnect is Pb-free and
the terminal finish material is
tin(Sn) (IPC/JEDEC J-STD-
609A.01)
Peak Pulse Power Dissipation(Fig.2)
by 10/1000usTest Waveform(Fig.4) (Note
1), (Note 2) -Stacked Die Parts (Note 5)
PPPM
4000
W
Power Dissipation on Infinite Heat Sink
atTL=50OC
PD
6.5
W
A
• Glass passivated chip junction
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3)
IFSM
300
• Fast response time: typically
less than 1.0ps from
0V to BV min
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only(Note 4)
VF
3.5/5.0
V
• Excellent clamping capability
-65 to
150
OperatingTemperature Range
StorageTemperature Range
TJ
°C
°C
-65 to
175
TSTG
RƟJL
RƟJA
Applications
TypicalThermal Resistance Junction to
Lead
15
75
°C/W
°C/W
TVS components are ideal for the protection of I/O
Interfaces, VCC bus and other vulnerable circuits used in
telecom, computer, Industrial and consumer electronic
applications.
TypicalThermal Resistance Junction to
Ambient
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated aboveTJ (initial) =25OC per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
component only, duty cycle=4 per minute maximum.
4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts.
5. For stacked die component details, please refer to part numbers labeled by * in Electrical
Characteristics.
Additional Infomarion
Functional Diagram
Bi-directional
Dꢀꢁꢀsꢂeeꢁ
Sꢀꢁꢂꢃes
ꢀesoꢁꢂꢃes
Cathode
Anode
Uni-directional
© 2020 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: JC.10/29/20
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