Datasheet > SMD4300SNL250T4

SMD4300SNL250T4

更新时间： 2023-12-18 00:00:00

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描述
SLDR PST WATR SOL SAC305 T4 250G

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SMD4300SNL250T4 数据手册

SMD4300SNL250T4

Datasheet revision 1.3

www.chipquik.com

Solder Paste Water-Washable SAC305 in Jar 250g T4 Mesh

Product Highlights

Printing speeds up to 100mm/sec

Long stencil life

Excellent wetting compatibility on most board finishes

Print grade

Wide process window

Clear residue

Compatible with enclosed print heads

Passes BONO test @1.56%

Low voiding

RoHS II and REACH compliant

Specifications

Alloy:

Mesh Size:

Sn96.5/Ag3.0/Cu0.5

Micron (µm) Range:

Flux Type:

Flux Classification:

Metal Load:

Melting Point:

Packaging:

20-38

Synthetic Water-Washable

REL0

88.75% Metal by Weight

217-220°C (423-428°F)

Jar 250g

Shelf Life:

Refrigerated >6 months, Unrefrigerated >2 months *See notes below:

*Shelf Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually

inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product

thoroughly for 2-3 minutes before inspection and use.

Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal

powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you

have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain

original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes.

Printer Operation

Print Speed: 25-100mm/sec

Squeegee Pressure: 70-250g/cm of blade

Under Stencil Wipe: Once every 10-25 prints, or as necessary

Stencil Life

>8 hours @ 20-50% RH 22-28°C (72-82°F)

>4 hours @ 50-70% RH 22-28°C (72-82°F)

Stencil Cleaning

Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling

Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C

(68-77°F) before use.

Transportation

This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground

or air will not impact this product’s stated shelf life.

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