SMD34HE1 THRU SMD320HE1
Features
• Halogen Free. “Green” Device (Note 1)
• For Surface Mount Applications
• Lead Free Finish/RoHS Compliant(Note 2) ("P" Suffix Designates
3 Amp
Compliant. See Ordering Information)
Schottky Rectifier
40~200 Volts
• Extremely Low Thermal Resistance
• Epoxy Meets UL 94 V-0 Flammability Rating
• Moisture Sensitivity Level 1
Maximum Ratings
• Operating Junction Temperature Range: -55⁰C to +125⁰C(34HE1)
• Operating Junction Temperature Range: -55⁰C to +150⁰C(36HE1~320HE1)
• Storage Temperature Range: -55⁰C to +150⁰C
• Typical Thermal Resistance: 6°C/W Junction to Lead(Note 3)
• Typical Thermal Resistance: 60°C/W Junction to Ambient(Note 3)
• Typical Thermal Resistance: 28°C/W Junction to Case(Note 4)
SOD-123HE1
HE
E
Maximum
Recurrent
Peak Reverse RMS Voltage
Voltage
Maximum DC
MCC
Part Number
Device
Marking
Maximum
Blocking
Voltage
B
D
Cathode Mark
SMD34HE1
SMD36HE1
SMD310HE1
SMD320HE1
H34
40V
28V
42V
70V
140V
40V
A
H36
60V
60V
C
H310
H320
100V
200V
100V
200V
L3 B1
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
IF(AV)
IFSM
See Fig.1
3.0A
80A
L2
L1
DIMENSIONS
MM
MIN MAX MIN MAX
0.030 0.035 0.75 0.90
0.033 0.041 0.85 1.05
Peak Forward Surge
Current
INCHES
8.3ms,Half Sine
DIM
NOTE
A
B
Instantaneous
Forward Voltage
B1 0.033 0.041 0.85 1.05
SMD34HE1
VF
0.52V(Max)
0.47V(Typ)
0.65V(Max)
0.60V(Typ)
0.80V(Max)
0.77V(Typ)
0.85V(Max)
IF=3.0A; TJ=25⁰C
IF=3.0A; TJ=25⁰C
IF=3.0A; TJ=25⁰C
IF=3.0A; TJ=25⁰C
C
D
E
0.004 0.010 0.10 0.25
0.075 0.083 1.90 2.10
0.114 0.122 2.90 3.10
SMD36HE1
SMD310HE1
SMD320HE1
L1 0.079 0.096 2.00 2.45
L2 0.016 0.033 0.40 0.85
L3 0.051 0.067 1.30 1.70
HE 0.138 0.154 3.50 3.90
0.82V(Typ)
Suggested Solder Pad Layout
Maximum DC Reverse
Current at Rated DC
Blocking Voltage
mm
2.54
0.96
TJ=25⁰C
TJ=125⁰C
TJ=25⁰C
TJ=125⁰C
IR
SMD34HE1~SMD36HE1
50µA
20mA
10µA
10mA
1.88
1.35
SMD310HE1~SMD320HE1
Note :
4.10
1.Halogen free "Green"products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
2.High Temperature Solder Exemption Applied, see EU Directive Annex 7a.
3.Mounted on P.C.B with 5×5mm Copper Pads, 2 OZ, FR4 PCB.
4.Mounted on P.C.B with Recommended Copper Pads, 2 OZ, FR4 PCB.
Rev.3-4-03162022
1/4
MCCSEMI.COM