Datasheet > SMD2SWLF.031 1LB

SMD2SWLF.031 1LB

更新时间： 2024-11-04 22:51:39

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
3页	107K
描述
LF SOLDER WIRE 99.3/0.7 TIN/COPP

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SMD2SWLF.031 1LB 数据手册

SMD2SWLF.031 1LB

Datasheet revision 1.4

www.chipquik.com

Solder Wire Sn99.3/Cu0.7 No-Clean with 2.2% Flux Core 1lb Spool

Product Highlights

No-Clean Water-Washable Synthetic Flux Core

The clear, non-corrosive, non-conductive residue is meant to be left on the board. Residues that do remain are water soluble

if you want to remove them. Clean with hot water at 60°C (140°F) minimum.

2.2% flux core

Halogen content: None

RoHS II and REACH compliant

Specifications

Alloy:

Sn99.3/Cu0.7

Wire Diameter:

Flux Type:

Flux Classification:

Melting Point:

Packaging:

0.031” (0.8mm)

No-Clean Water-Washable Synthetic

ROL0

227°C (441°F)

1 lb spool

Test Results

Test J-STD-004 or other

requirements as stated

Copper Mirror

Corrosion

Quantitative Halides

Electrochemical Migration

Surface Insulation Resistance 85°C,

85% RH @ 168 Hours

Visual

Test Requirement

Result

IPC-TM-650: 2.3.32

IPC-TM-650: 2.6.15

IPC-TM-650: 2.3.28.1

IPC-TM-650: 2.6.14.1

L: No breakthrough

L: No corrosion

L: <0.5%

L: <1 decade drop (No-clean)

L: ≥100MΩ (No-clean)

IPC-TM-650: 2.6.3.7

IPC-TM-650: 3.4.2.5

Electronic Industry Citizenship

Coalition (EICC)

Clear and free from precipitation

Compliant

Conflict Minerals Compliance

REACH Compliance

Articles 33 and 67 of Regulation (EC)

No 1907/2006

Contains no substance >0.1% w/w that

is listed as a SVHC or restricted for

use in solder materials

Conforms to the following Industry Standards:

J-STD-004B, Amendment 1 (Solder Fluxes):

J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):

RoHS 2 Directive 2011/65/EU:

Yes

12 3

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