Datasheet > SMD210HPL

SMD210HPL

更新时间： 2023-12-06 20:11:15

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
3页	873K
描述
Tape&Reel: 2.5Kpcs/Reel;

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数据手册

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SMD210HPL 数据手册

SMD210HPL

Features

• Halogen Free. “Green” Device (Note 1)

• Lead Free Finish/RoHS Compliant(Note 2) ("P" Suffix Designates

Compliant. See Ordering Information)

2 Amp Schottky

• High Surge Capability

• Low Forward Voltage

• Low Profile Package

• Epoxy Meets UL 94 V-0 Flammability Rating

• Moisture Sensitivity Level 1

Rectifier

100 Volts

Maximum Ratings

• Operating Junction Temperature Range: -55⁰C to +175⁰C

• Storage Temperature Range: -55⁰C to +175⁰C

• Typical Thermal Resistance(Note3): 60°C/W Junction to Ambient

• Typical Thermal Resistance(Note3): 30°C/W Junction to Case

• Typical Thermal Resistance(Note3): 21°C/W Junction to Lead

SOD-123FL

Maximum

Recurrent

Peak Reverse RMS Voltage

Voltage

Maximum DC

Blocking

MCC

Part Number

Device

Marking

Maximum

Voltage

Cathode Mark

SMD210HPL

M10H

100V

70V

100V

Electrical Characteristics @ 25°C Unless Otherwise Speciﬁed

I_F(AV)

I_FSM

P_D

Average Forward Current

Surge Forward Current

Power Dissipation

T_L=90⁰C

2.0A

50A

8.3ms,Half Sine

1.68W

DIMENSIONS

INCHES

DIM

NOTE

MIN MAX MIN MAX

0.130 0.152 3.30 3.85

0.100 0.122 2.55 3.10

0.055 0.075 1.40 1.90

0.035 0.053 0.90 1.35

0.020 0.041 0.50 1.05

I_FM=2.0A;T_J=25°C

Forward Voltage

V_F

0.85V(Max)

1.0µA(Typ)

5.0µA(Max)

T_J=25⁰C

I_R

Maximum DC Reverse Current

Typical Junction Capacitance

0.010

----

0.25

----

---- 0.010

0.25

f=1.0MHz,

Vr=4V

C_J

210pF(Typ)

Suggested Solder Pad Layout

Note: 1. Halogen free "Green” products are defined as those which contain <900ppm bromine,

<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

2. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7a.

3. Thermal Resistance:PC Board Mounted on 0.2*0.2''(5*5mm) copper pad area.

2.36mm

1.22mm

0.91mm

Rev.3-3-12012020

1/3

MCCSEMI.COM

12 3

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