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SMD2060-25000 PDF预览

SMD2060-25000

更新时间: 2022-09-29 19:04:11
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
2页 142K
描述
SOLDER SPHERES SAC305 .030" DIAM

SMD2060-25000 数据手册

 浏览型号SMD2060-25000的Datasheet PDF文件第2页 
SMD2060-25000  
Datasheet revision 1.3  
www.chipquik.com  
Sn96.5/Ag3.0/Cu0.5 Solder Spheres for BGAs  
Product Highlights  
Chip Quik® BGA solder spheres are manufactured from virgin materials to meet or exceed the requirements of building or  
repairing BGA packages. Chip Quik® BGA solder spheres also exceed both the IPC and MIL standards for purity levels and  
size tolerances. Nominal sizes are available from 8 to 30 mil.  
Product Specifications  
Part Number  
Alloy  
Melting Point  
Diameter  
Quantity (by weight)  
SMD2016  
SMD2016‐25000  
SMD2020  
SMD2020‐25000  
SMD2024  
SMD2024‐25000  
SMD2028  
SMD2028‐25000  
SMD2032  
SMD2032‐25000  
SMD2036  
SMD2036‐25000  
SMD2040  
SMD2040‐25000  
SMD2050  
SMD2050‐25000  
SMD2055  
250,000  
25,000  
250,000  
25,000  
250,000  
25,000  
250,000  
25,000  
250,000  
25,000  
250,000  
25,000  
250,000  
25,000  
250,000  
25,000  
250,000  
25,000  
250,000  
25,000  
0.008" (0.2mm)  
0.010" (0.25mm)  
0.012" (0.3mm)  
0.014" (0.35mm)  
0.016" (0.4mm)  
0.018" (0.45mm)  
0.020" (0.5mm)  
0.024" (0.6mm)  
0.025" (0.63mm)  
0.030" (0.76mm)  
Sn96.5/Ag3.0/Cu0.5  
217‐220°C (423‐428°F)  
SMD2055‐25000  
SMD2060  
SMD2060‐25000  
Shelf Life:  
Test Results  
Test J-STD-004 or other  
requirements as stated  
Conflict Minerals Compliance  
>24 months  
Test Requirement  
Result  
Electronic Industry Citizenship  
Coalition (EICC)  
Compliant  
REACH Compliance  
Articles 33 and 67 of Regulation (EC)  
No 1907/2006  
Contains no substance >0.1% w/w that  
is listed as a SVHC or restricted for  
use in solder materials  
Conforms to the following Industry Standards:  
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):  
RoHS 2 Directive 2011/65/EU:  
Yes  
Yes  
1
© 1994-2018 Chip Quik® Inc.  

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