®
POLYFUSE RESETTABLE FUSES
SMD Type, 6 V / 9 V / 15V
Specifications
SMD0805
Standard
Packaging
UL 1434 1st Edition
A
Blistertape and reel Ø 178 mm
Materials
Terminals:
CSA C22.2 No. 0 CSA TIL No. CA-3A
Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Solder Material: Sn
Approvals
cULus Recognition
TÜV
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider derating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Features
These devices offer wide range in hold currents
from 0.1 A to 1.0 A and voltages from 6 V to
15 V. The SMD0805 product line is suitable for
high density circuit board applications in com-
puters, cellular phone and general electronics.
Suitable for reflow soldering.
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3
Reflow only
Dimensions (mm)
Solder pad Layout (mm)
1.2
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
1.5
1.0
1.0
Dimensions (mm)
Model
A
B
C
D
Min
E
packaging quantity
tape
Min Max
Min Max
Min Max
Min
Max
SMD0805P010TS/TF
SMD0805P020TS/TF
SMD0805P035TS/TF
SMD0805P050TS/TF
SMD0805P075TS/TF
SMD0805P100TS/TF
2.00
2.00
2.00
2.00
2.00
2.00
2.20
2.20
2.20
2.20
2.20
2.20
1.20
1.20
1.20
1.20
1.20
1.20
1.50
1.50
1.50
1.50
1.50
1.50
0.55
0.55
0.45
0.75
0.75
0.80
1.00
1.00
0.75
1.25
1.25
1.80
0.10
0.10
0.10
0.10
0.20
0.20
0.20
0.20
0.20
0.20
0.15
0.15
0.45
0.45
0.45
0.45
0.45
0.45
4,000
4,000
4,000
3,000
3,000
2,000
Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).
Model
Ihold
(A)
ITrip
(A)
Vmax. dc
(V)
Imax.
(A)
max. time to trip
(sec. @ A)
Pd max.
(W)
Resistance
Rmin.(Ω) Rtyp.(Ω) RI max.(Ω)
Approvals
SMD0805P010TS/TF
SMD0805P020TS/TF
SMD0805P035TS/TF
SMD0805P050TS/TF
SMD0805P075TS/TF
SMD0805P100TS/TF
0.10
0.20
0.35
0.50
0.75
1.00
0.30
0.50
0.75
1.00
1.50
1.95
15
9
6
6
6
40
40
40
40
40
40
1.50 @ 0.50
0.02 @ 8.00
0.10 @ 8.00
0.10 @ 8.00
0.20 @ 8.00
0.30 @ 8.00
0.5
0.5
0.5
0.5
0.6
0.6
1.000
0.650
0.250
0.150
0.090
0.060
3.500
2.000
0.750
0.500
0.260
0.120
6.000
3.500
1.200
0.850
0.350
0.210
•
•
•
•
p
p
•
•
•
•
p
p
6
Please choose TS for SnPb and TF for Sn plating
NOTE:
Pd
R min
R 1max
=
Power dissipated from device when in the tripped state at 20 °C still air.
Minimum resistance of device in initial (un-soldered) state.
Ihold
I trip
=
Hold current: maximum current device will pass without tripping in 20 °C still air.
Trip current: minimum current at which the device will trip in 20 °C still air.
=
=
=
=
=
Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Vmax
Imax
Maximum voltage device can withstand without damage at rated current (Imax
)
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
Specifications are subject to change without notice
Maximum fault current device can withstand without damage at rated voltage (Vmax
)
Order
Qty.
Order-
Model
Packaging
Information
Number
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WICKMANN Group and its products to the Littelfuse portfolio.
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040606