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SMCJ200 PDF预览

SMCJ200

更新时间: 2024-09-24 21:04:51
品牌 Logo 应用领域
美微科 - MCC 二极管
页数 文件大小 规格书
5页 126K
描述
Trans Voltage Suppressor Diode, 1500W, 200V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AB, PLASTIC, SMC, 2 PIN

SMCJ200 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DO-214AB包装说明:R-PDSO-C2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.37其他特性:UL RECOGNIZED
最大击穿电压:247 V最小击穿电压:224 V
配置:SINGLE二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJEDEC-95代码:DO-214AB
JESD-30 代码:R-PDSO-C2JESD-609代码:e0
最大非重复峰值反向功率耗散:1500 W元件数量:1
端子数量:2封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性:UNIDIRECTIONAL
认证状态:Not Qualified最大重复峰值反向电压:200 V
表面贴装:YES技术:AVALANCHE
端子面层:Tin/Lead (Sn/Pb)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:30
Base Number Matches:1

SMCJ200 数据手册

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SMCJ5.0(C)A  
THRU  
SMCJ440(C)A  
M C C  
Micro Commercial Components  
20736 Marilla Street Chatsworth  
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ꢆꢇꢈꢉꢊꢋꢂꢌꢍꢄꢍ ꢂ!ꢎꢄ"#ꢃꢅꢅ  
$ꢏ%ꢋꢂ ꢂꢂ ꢌꢍꢄꢍ ꢂ!ꢎꢄ"#ꢃꢅꢃ  
TM  
Micro Commercial Components  
Features  
Transient  
Voltage Suppressor  
5.0 to 440 Volts  
1500 Watt  
For surface mount application in order to optimize board space  
Low inductance  
Low profile package  
Built-in strain relief  
Glass passivated junction  
Typical ID less than 1uA above 10V  
High temperature soldering: 260oC/10 seconds at terminals  
Plastic package has Underwrites Laboratory Flammability  
Classification 94V-O  
DO-214AB  
(SMC) (LEAD FRAME)  
G
UL Recognized File # E222849  
For Bidirectional Devices Add “C” To The Suffix Of The Part  
Number: i.e.SMCJ5.0CA for 5% Tolerance  
H
D
Mechanical Data  
A
C
CASE: JEDEC DO-214AB molded plastic body over  
B
E
passivated junction  
Terminals: solderable per MIL-STD-750, Method 2026  
Polarity: Color band denotes positive end( cathode) except  
Bi-directional types.  
F
DIMENSIONS  
INCHES  
MIN  
MM  
MIN  
DIM  
A
MAX  
MAX  
2.62  
NOTE  
.079  
.108  
.103  
.128  
.008  
.012  
.050  
.320  
.280  
.245  
2.00  
2.75  
B
3.25  
Standard packaging: 16mm tape per ( EIA 481).  
Weight: 0.007 ounce, 0.21 gram  
C
.002  
0.051  
0.152  
0.76  
7.75  
0.203  
0.305  
1.27  
8.13  
D
.006  
.030  
E
F
..305  
.260  
G
H
6.60  
7.11  
6.22  
Maximum Ratings @ 25oC Unless Otherwise Specified  
.220  
5.59  
Peak Pulse Current on  
10/1000us  
IPPM See Table 1 Amps  
SUGGESTED SOLDER  
PAD LAYOUT  
waveform(Note1, Fig3)  
Peak Pulse Power  
0.185  
PPPM Minimum Watts  
1500  
Disspation on 10/1000us  
waveform(Note1,2,Fig1)  
Peak forward surge  
current (JEDEC  
IFSM)  
200.0  
Amps  
0.121”  
Method) (Note 2,3)  
Operation And Storage  
Temperature Range  
TJ,  
TSTG  
-55oC to  
+150oC  
0.060”  
NOTES:  
1.  
2.  
3.  
Non-repetitive current pulse per Fig.3 and derated above TA=25oC per Fig.2.  
Mounted on 8.0mm2 copper pads to each terminal.  
8.3ms, single half sine-wave or equivalent square wave, duty cycle=4 pulses per. Minutes maximum.  
www.mccsemi.com  
1 of 5  
Revision : 9  
2007/11/20  

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