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SMBJP6KE170CAHE3 PDF预览

SMBJP6KE170CAHE3

更新时间： 2024-11-07 14:49:03
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
5页 553K
描述
Tape&Reel: 3Kpcs/Reel;

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中文翻译

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SMBJP6KE170CAHE3 数据手册

 浏览型号SMBJP6KE170CAHE3的Datasheet PDF文件第2页浏览型号SMBJP6KE170CAHE3的Datasheet PDF文件第3页浏览型号SMBJP6KE170CAHE3的Datasheet PDF文件第4页浏览型号SMBJP6KE170CAHE3的Datasheet PDF文件第5页 
SMBJP6KE12(C)AHE3 THRU SMBJP6KE220(C)AHE3  
E480232  
Features  
•
•
•
•
AEC-Q101 Qualified  
For Surface Mount Applicationsin Order to Optimize Board Space  
Low Inductance  
Available in Both Unidirectional and Bidirectional Construction  
and Suffix"C" Designates Bidirectional Type  
Halogen Free. "Green" Device (Note 1)  
Excellent Clamping Capability  
Fast Response Time: Typical Less than 1.0ps From 0 Volts to VBR  
Minimum  
600 Watt TVS  
12 to 220 Volts  
•
•
•
•
•
Moisture Sensitivity Level 1  
Epoxy Meets UL 94 V-0 Flammability Rating  
SMB (DO-214AA)  
(LEAD FRAME)  
•
Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix Designates  
RoHS Compliant. See Ordering Information)  
H
Mechanical Data  
• Polarity: Color Band Denotes Positive End( cathode)  
Except Bi-directional Types  
J
• Maximum Soldering Temperature:260°C for 10 Seconds  
• Manufacturing Code Added for Better Tracking  
Cathode Mark  
• Terminals: Solderable Per MIL-STD-750, Method 2026  
A
C
E
Maximum Ratings  
D
B
F
•
•
•
Operating Junction Temperature Range: -55°C to +175°C  
Storage Temperature Range: -55°C to +175°C  
Thermal Resistance : 20°C/W Junction to Lead  
G
DIMENSIONS  
MM  
INCHES  
DIM  
NOTE  
MIN MAX MIN MAX  
0.079 0.103 2.00 2.62  
0.075 0.087 1.91 2.21  
0.002 0.008 0.05 0.20  
0.006 0.012 0.15 0.31  
0.030 0.060 0.76 1.52  
0.065 0.091 1.65 2.32  
0.200 0.220 5.08 5.59  
0.160 0.191 4.06 4.85  
0.130 0.155 3.30 3.94  
•
Thermal Resistance : 25°C/W Junction to Case  
A
B
C
D
E
F
G
H
J
Electrical Characteristics @ 25°C Unless Otherwise Specified  
Peak Pulse Power  
Surge Current on  
10/1000μs Waveform  
IPP  
See the Table Note 3  
Peak Pulse Power  
Dissipation  
PPP  
600W  
Note 3  
NOTES:  
SUGGESTED SOLDER PAD LAYOUT  
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,  
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.  
2. High Temperature Solder Exemption Applied, see EU Directive Annex 7a.  
1.80mm  
3. Non-repetitive current pulse, per Fig.3 and derated above T =25 °C per Fig.4.  
A
Pin Configuration:  
2.30mm  
Cathode  
Anode  
Uni-directional  
Bi-directional  
2.50mm  
Rev.3-6-12152021  
1/5  
MCCSEMI.COM  
12345

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