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SMBJP6KE110-TP PDF预览

SMBJP6KE110-TP

更新时间: 2024-11-02 10:52:35
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
5页 415K
描述
Trans Voltage Suppressor Diode,

SMBJP6KE110-TP 数据手册

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SMBJP6KE6.8(C)A  
THRU  
SMBJP6KE550(C)A  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
Halogen free available upon request by adding suffix "-HF"  
·
Transient  
Voltage Suppressor  
6.8 to 550 Volts  
600 Watt  
For surface mount applicationsin in order to optimize board space  
Available in both unidirectional and bidirectional construction  
and suffix"C" designates bidirectional type  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Fast response time: typical less than 1.0ps from 0 volts to  
VBR minimum  
Low inductance  
Excellent clamping capability  
UL Recognized File # E331408  
DO-214AA  
(SMBJ) (LEAD FRAME)  
Mechanical Data  
·
·
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
A
Terminals: solderable per MIL-STD-750, Method 2026  
Polarity: Color band denotespositive end (cathode)  
except Bidirectional  
B
Maximum soldering temperature: 260oC for 10 seconds  
C
Maximum Ratings @ 25oC Unless Otherwise Specified  
F
H
Peak Pulse Current on  
10/1000us waveform  
Peak Pulse Power  
Dissipation  
Operation And Storage TJ, TSTG  
Temperature Range  
Thermal Resistance  
IPP  
See Table 1 Note: 2  
D
G
PPP  
600W  
Note: 2,  
E
-55oC to  
+175oC  
25O C/W  
20OC/W  
DIMENSIONS  
RthJC  
RthJL  
INCHES  
MIN  
MM  
MIN  
4.06  
3.30  
0.15  
0.76  
5.08  
2.00  
1.91  
DIM  
A
MAX  
.185  
.155  
.012  
.060  
.220  
.096  
.087  
.008  
MAX  
4.70  
3.94  
0.31  
1..52  
5.59  
2.44  
2.21  
0.203  
NOTE  
.160  
.130  
.006  
.030  
.200  
.079  
.075  
.002  
B
C
D
E
F
NOTES:  
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
G
H
0.05  
2. Non-repetitive current pulse, per Fig.3 and derated above  
TA=25oC per Fig.2.  
SUGGESTED SOLDER  
PAD LAYOUT  
0.106"  
0.082”  
0.050”  
www.mccsemi.com  
Revision: E  
2013/07/18  
1 of 5  

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