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SMBJ5930B PDF预览

SMBJ5930B

更新时间: 2024-12-01 13:48:15
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
3页 510K
描述
Tape: 3K/Reel;

SMBJ5930B 技术参数

是否Rohs认证: 不符合生命周期:Active
零件包装代码:DO-214AA包装说明:R-PDSO-C2
针数:2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.21配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
JEDEC-95代码:DO-214AAJESD-30 代码:R-PDSO-C2
JESD-609代码:e0元件数量:1
端子数量:2封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性:UNIDIRECTIONAL
最大功率耗散:1.5 W认证状态:Not Qualified
标称参考电压:16 V表面贴装:YES
技术:ZENER端子面层:TIN LEAD
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:30最大电压容差:5%
工作测试电流:23.4 mABase Number Matches:1

SMBJ5930B 数据手册

 浏览型号SMBJ5930B的Datasheet PDF文件第2页浏览型号SMBJ5930B的Datasheet PDF文件第3页 
SMBJ5926B  
THRU  
SMBJ5956B  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Features  
1.5 Watt  
Surface Mount  
Silicon  
l
l
l
l
l
Surface Mount Application  
11 thru 200 Volt Voltage Range  
Low Inductance,Low Profile Mounting  
Glass Passivated Junction  
Zener Diodes  
Available on Tape and Reel  
Mechanical Data  
DO-214AA  
(SMBJ) (LEAD FRAME)  
l
l
l
l
l
l
CASE: JEDEC DO-214AA molded Surface Mountable  
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band.  
Packaging: Standard 12mm Tape (see EIA 481)  
Maximum temperature for soldering: 260oC for 10 seconds.  
For surface mount applications with flame retardent epoxy  
Meeting UL94V-0  
A
B
Maximum Ratings @ 25oC Unless Otherwise Specified  
Peak Surge  
Current  
IF  
See Table 1  
C
Maximum  
Forward  
VF  
1.5V  
(Note: 1)  
(Note: 2)  
F
H
Voltage  
D
G
Steady State  
P(AV)  
1.5W  
Power  
E
Dissipation  
TJ, TSTG -55oC to  
+150 oC  
DIMENSIONS  
Operation And  
Storage  
INCHES  
MIN  
MM  
MIN  
DIM  
A
B
C
D
E
F
G
H
MAX  
.185  
.155  
.012  
.060  
.220  
.103  
.087  
.008  
MAX  
4.70  
3.94  
0.31  
1..52  
5.59  
2.62  
2.21  
0.203  
NOTE  
Temperature  
.160  
.130  
.006  
.030  
.200  
.079  
.075  
.002  
4.06  
3.30  
0.15  
0.76  
5.08  
2.01  
1.91  
0.05  
NOTES:  
SUGGESTED SOLDER  
PAD LAYOUT  
1.  
2.  
Forward Current @ 200mA.  
0.106"  
Mounted on 5.0mm2 (.013mm thick) Iand areas.  
Lead temperature at TL=75oC  
0.083”  
0.050”  
www.mccsemi.com  
Revision: 3  
2003/04/30  

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