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SMBJ5922B-TPX01 PDF预览

SMBJ5922B-TPX01

更新时间: 2024-11-19 14:44:47
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美微科 - MCC /
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4页 314K
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SMBJ5922B-TPX01 数据手册

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SMBJ5913B-TPX01  
THRU  
SMBJ5942B-TPX01  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
1.5 Watt  
Surface Mount  
Silicon  
Surface Mount Application  
3.3 thru 51 Volt Voltage Range  
Low Inductance,Low Profile Mounting  
Glass Passivated Junction  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
Zener Diodes  
Mechanical Data  
DO-214AA  
CASE: JEDEC DO-214AA molded Surface Mountable  
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band.  
(SMB) (LEAD FRAME)  
Packaging: Standard 12mm Tape (see EIA 481)  
Maximum temperature for soldering: 260oC for 10 seconds.  
A
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
B
Maximum Ratings @ 25oC Unless Otherwise Specified  
Output  
IF  
C
200mA  
Current  
Maximum  
VF  
1.5V  
(Note: 2)  
(Note: 3)  
F
H
Forward  
Voltage  
D
G
Steady State  
Power  
P(AV)  
1.5W  
E
Dissipation  
DIMENSIONS  
Operation And  
TJ, TSTG -55oC to  
+150 oC  
INCHES  
MM  
Storage  
DIM  
A
B
C
D
E
F
G
H
MIN  
MAX  
MIN  
4.06  
3.30  
0.15  
0.76  
5.08  
2.00  
1.91  
0.05  
MAX  
4.70  
3.94  
0.31  
1..52  
5.59  
2.44  
2.21  
0.203  
NOTE  
.160  
.130  
.006  
.030  
.200  
.079  
.075  
.002  
.185  
.155  
.012  
.060  
.220  
.096  
.087  
.008  
Temperature  
NOTES:  
1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
2. Forward Current @ 200mA.  
3. Mounted on 5.0mm2 (1oz thick) Iand areas.  
SUGGESTED SOLDER  
PAD LAYOUT  
Lead temperature at TL=75oC  
0.106"  
0.083”  
0.050”  
www.mccsemi.com  
Revision: A  
2011/01/01  
1 of 4  

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