Datasheet > SMBJ300A

SMBJ300A

更新时间： 2024-02-08 01:25:02

品牌	Logo	应用领域
银河微电 - BL Galaxy Electrical		局域网光电二极管
页数	文件大小	规格书
6页	261K
描述
TRANSIENT VOLTAGE SUPPRESSOR

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中文翻译

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技术参数
数据手册

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SMBJ300A 技术参数

是否Rohs认证：	符合	生命周期：	Contact Manufacturer
Reach Compliance Code：	unknown	风险等级：	5.44
Is Samacsys：	N	二极管类型：	TRANS VOLTAGE SUPPRESSOR DIODE
峰值回流温度（摄氏度）：	NOT SPECIFIED	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

SMBJ300A 数据手册

Production specification

TRANSIENT VOLTAGE SUPPRESSOR

FEATURES

SMBJ5.0--SMBJ440CA

Glass passivated junction

Low incremental surge resistance, excellent clamping capability

Low profile package with built-in strain relief for surface mounted applications

600W peak pulse power capability with a 10/1000μs

Wave form, repetition rate (duty cycle): 0.01%

Very fast response time

High temperature soldering guaranteed: 250°C/10 seconds at terminals

MECHANICAL DATA

Case: JEDEC DO-214AA molded plastic over passivated chip

Terminals: solder plated, solderable per MIL-STD-750, method 2026

Polarity: foruni-directional types the color band denotes the cathode, which is postitive with respect to the

anode under normal TVS operation

Mounting position: any Weight: 0.002 ounces, 0.064 grams

Devices for Bidirectional Applications

For bi-directional devices, use suffix C or CA (e.g. SMBJ10C, SMBJ10CA). Electrical characteristics apply in both

directions.

Maximum Ratings and Thermal Characteristics ^(T_A^{=25℃ unless otherwise noted)}

Characteristic

Symbol

Value

Unit

Peak power dissipation with a 10/1000μs waveform

(NOTE 1,2, FIG.1)

P_PPM

Minimum 600

Peak pulse current with a 10/1000μs waveform (NOTE 1)

I_PPM

See Table Below

100.0

Typical thermal resistance, junction to ambient ( (NOTE 2)

R _{θ JA}

℃/W

Peak forward surge current, 8.3ms single half sine-wave uni-directional

only (NOTE 3)

I_FSM

100.0

℃/W

℃

Typical thermal resistance, junction to lead

R _{θ J L}

Operating junction and storage temperature range

T_J, T_STG

-55---+150

NOTES: (1) Non-repetitive current pules, per Fig. 3 and derated above TA=25 per Fig. 2.

(2) Mounted on minimum recommended pad layout.

(3) Mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pads to each terminal.

Document Number: SMB601AF

www.gmicroelec.com

12 3 4 5 6

中文翻译

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