SMBJ5.0 thru 188CA
Surface Mount TRANSZORB®
Transient Voltage Suppressors
DO-214AA (SMB J-Bend)
Stand-off Voltage 5.0 to 188V
Cathode Band
Peak Pulse Power 600W
0.086 (2.20)
0.077 (1.95)
0.155 (3.94)
0.130 (3.30)
Mounting Pad Layout
0.106 MAX
(2.69 MAX)
0.180 (4.57)
0.160 (4.06)
0.012 (0.305)
0.006 (0.152)
0.083 MIN
(2.10 MIN)
0.096 (2.44)
0.084 (2.13)
0.050 MIN
(1.27 MIN)
Dimensions in inches
and (millimeters)
0.220 REF
0.060 (1.52)
0.030 (0.76)
0.008
(0.203)
Max.
0.220 (5.59)
0.205 (5.21)
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• Low profile package with built-in strain relief for
surface mounted applications
Mechanical Data
Case: JEDEC DO-214AA molded plastic over
passivated junction
• Glass passivated junction
• Low incremental surge resistance, excellent
clamping capability
Terminals: Solder plated, solderable per
MIL-STD-750, Method 2026
• 600W peak pulse power capability with a 10/1000µs
waveform, repetition rate (duty cycle): 0.01%
• Very fast response time
Polarity: For unidirectional types the band denotes
the cathode, which is positive with respect to the
anode under normal TVS operation
Weight: 0.003oz., 0.093g
Packaging codes/options:
• High temperature soldering guaranteed:
250°C/10 seconds at terminals
5/3.2K per 13” Reel (12mm tape), 32K/box
2/750 EA per 7” Reel (12mm tape), 40K/box
• Contact local sales office for gull-wing
(SMBG prefix) lead form (DO-215AA)
Devices for Bidirectional Applications
For bi-directional devices, use suffix CA (e.g. SMBJ10CA). Electrical characteristics apply in both directions.
.
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter
Symbol
Value
Unit
Peak pulse power dissipation with
PPPM
Minimum 600
See Table Below
W
a 10/1000µs waveform(1)(2) (Fig. 1)
Peak pulse current with a 10/1000µs waveform(1)
IPPM
A
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
uni-directional only(2)
IFSM
100
A
Typical thermal resistance, junction to ambient(4)
Typical thermal resistance, junction to lead
RθJA
RθJL
100
20
°C/W
°C/W
°C
Operating junction and storage temperature range
TJ, TSTG
–55 to +150
Notes: (1) Non-repetitive current pulse, per Fig.3 and derated above TA = 25°C per Fig. 2
(2) Mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pads to each terminal
(3) Mounted on minimum recommended pad layout
10/4/00