RoHS
SMB3Z6.8AQ THRU SMB3Z220AQ
Surface Mount Zener Diodes
COMPLIANT
Features
● Low profile package
● Ideal for automated placement
● Glass passivated chip junction
● Meets MSL level 1, per J-STD-020, LF maximum peak
of 260 °C
● Part no. with suffix “Q” means AEC-Q101 qualified
Mechanical Data
●
ackage: DO-214AA (SMB)
P
Molding compound meets UL 94 V-0 flammability
rating, RoHS-compliant, halogen-free
● Terminals: Tin plated leads, solderable per
J-STD-002 and JESD22-B102
●
Cathode line denotes the cathode end
Polarity:
(T =25℃Unless otherwise specified
■
Maximum Ratings
)
a
PARAMETER
SYMBOL
MAX
3.0
UNIT
W
DC power dissipation at TL = 75 °C
Maximum instantaneous forward voltage@ IF=200mA
Maximum junction temperature
PD
VF
V
1.5
TJ
℃
-55 to +150
-55 to +150
Storage temperature range
Tstg
℃
Thermal Characteristics (T =25℃Unless otherwise specified)
■
a
PARAMETER
SYMBOL
Conditions
junction to lead
junction to ambient
VALUE
UNIT
℃/W
℃/W
(1)
RθJ-L
25
Thermal resistance(Typical)
(1)
RθJ-A
100
Note
(1) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.4" x 0.4" (10 mm x 10 mm) copper pad areas
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S-S4817
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com
Rev,1.1,27-Nov-23