Datasheet > SMB3EZ11D5

SMB3EZ11D5

更新时间： 2024-11-06 00:32:51

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
4页	575K
描述
3 W Glass Passivated Junction Silicon Zener Diode 5.6-200 Volts

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中文翻译

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数据手册

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SMB3EZ11D5 数据手册

M C C

SMB3EZ5.6D5

THRU

SMB3EZ200D5

Micro Commercial Components

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Features

3 W Glass Passivated

•

Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates

Compliant. See ordering information)

Junction Silicon

Glass Passivated Junction

•

Excellent Clamping Capability

Built-in Strain Relief

Low Inductance

Zener Diode

5.6-200 Volts

•

Halogen free available upon request by adding suffix "-HF"

Mechanical Data

ꢀ

DO-214AA

ꢀ

(SMB) (LEAD FRAME)

ꢀ

Epoxy meets UL 94 V-0 flammability rating

Moisture Sensitivity Level 1

TERMINALS : Solder plated, solderable per MIL-STD-750,

ꢀ

method 2026

ꢀ

POLARITY : Color band denotes positive end (cathode)

Maximum Ratings @ 25^oC Unless Otherwise Specified

DC Power Dissipation

Watts

P^D

(Note2) at T_L=50 C

Maximum forward

1.5

Vdc

voltage at I_F=200mA

DIMENSIONS

-55^oC to

+150^oC

Junction and Storage

Temperature Range

INCHES

MIN

4.06

3.30

0.15

0.76

5.08

2.00

1.91

T_J, T_STG

DIM

MAX

.185

.155

.012

.060

.220

.096

.087

.008

MAX

4.70

3.94

0.31

1..52

5.59

2.44

2.21

0.203

NOTE

.160

.130

.006

.030

.200

.079

.075

.002

NOTES:

0.05

High Temperature Solder Exemptions Applied, see EU Directive Annex 7.

T =Lead temperature at 3/8"(9.5mm)from body

SUGGESTED SOLDER

PAD LAYOUT

0.106"

0.083”

0.050”

www.mccsemi.com

Revision: A

2015/12/05

1 of 4

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