SMAJP4KE12(C)AHE3 THRU SMAJP4KE220(C)AHE3
E480232
Features
•
AEC-Q101 Qualified
400 Watt TVS
•
For Surface Mount Applicationsin in Order to Optimize Board Space
12 to 220 Volts
•
•
•
Halogen Free. “Green” Device (Note 1)
Low Profile Package
Unidirectional and Bidirectional Available,for Bidirectional Devices
add 'C' Suffix to The pn#, i.e.SMAJP4KE12CAHE3
•
Fast Response Time: Typical Less Than 1.0ps From 0 Volts to VBR
Minimum
•
•
Moisture Sensitivity Level 1
Epoxy Meets UL 94 V-0 Flammability Rating
SMA (DO-214AC)
LEAD FRAME
Mechanical Data
• Polarity: Color Band Denotes Positive end (cathode) Except Bidirectional
• Maximum Soldering Temperature: 260°C for 10 Seconds
H
• Manufacturing Code Added for Better Tracking
• CASE:JEDEC DO214AC
J
Cathode Mark
• Terminals: Plated Axial leads, Solderable Per MIL-STD-750,
Methode 2026
A
C
E
Maximum Ratings
D
B
F
•
•
•
Operating Junction Temperature Range: -55°C to +175°C
G
Storage Temperature Range: -55°C to +175°C
DIMENSIONS
Typical Thermal Resistance: 100°C/W Junction to Ambient
INCHES
MM
DIM
NOTE
MIN MAX MIN MAX
0.079 0.096 2.00 2.44
0.050 0.064 1.27 1.63
0.002 0.008 0.051 0.203
Peak Pulse Power
Surge Current with a
10/1000μs Waveform
A
B
C
D
E
F
G
H
J
IPP
See the Table Note 2
--- 0.020
---
0.51
0.030 0.060 0.76 1.52
0.065 0.091 1.65 2.32
0.189 0.220 4.80 5.59
0.157 0.181 4.00 4.60
0.090 0.115 2.25 2.92
Peak Pulse Power
Dissipation
PPP
400W
Note 2
Note:
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
SUGGESTED SOLDER PAD LAYOUT
2. Non-repetitive current pulse, per Fig.3 and derated above TA=25 °C per Fig.4.
3. Mounted on 5.0mm2 copper pads to each terminal.
2.27mm
Pin Configuration:
2.16mm
Cathode
Anode
Uni-directional
Bi-directional
1.78mm
Rev.3-5-12012020
1/5
MCCSEMI.COM