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SMAJ4741AP PDF预览

SMAJ4741AP

更新时间: 2024-11-08 12:59:59
品牌 Logo 应用领域
美微科 - MCC 二极管齐纳二极管测试光电二极管
页数 文件大小 规格书
3页 389K
描述
DIODE 11 V, 1 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-214AC, PLASTIC, SMAJ, 2 PIN, Voltage Regulator Diode

SMAJ4741AP 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:DO-214AC
包装说明:R-PDSO-C2针数:2
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.36
Is Samacsys:N其他特性:LOW IMPEDANCE
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODE最大动态阻抗:8 Ω
JEDEC-95代码:DO-214ACJESD-30 代码:R-PDSO-C2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:200 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:UNIDIRECTIONAL
最大功率耗散:1 W认证状态:Not Qualified
标称参考电压:11 V子类别:Voltage Reference Diodes
表面贴装:YES技术:ZENER
端子面层:Matte Tin (Sn)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:10
最大电压容差:5%工作测试电流:23 mA
Base Number Matches:1

SMAJ4741AP 数据手册

 浏览型号SMAJ4741AP的Datasheet PDF文件第2页浏览型号SMAJ4741AP的Datasheet PDF文件第3页 
M C C  
SMAJ4728  
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SMAJ4764  
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21201 Itasca Street Chatsworth  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
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Features  
Silicon  
1 Watt  
l
For surface mount application (flat handing surface for  
Accurate placement)  
l
l
l
l
3.3 thru 100 Volt Voltage Range  
High Surge Current Rating  
Higher Voltages Available  
Available on Tape and Reel  
Zener Diodes  
Mechanical Data  
DO-214AC  
(SMAJ) (High Profile)  
l
CASE: JEDEC DO-214AC molded plastic body over  
passivated chip  
H
l
l
l
l
Terminals solderable per MIL-STD-750, Method 2026  
Polarity is indicated by cathode band.  
Maximum temperature for soldering: 260oC for 10 seconds.  
For surface mount applications with flame retardent epoxy  
Meeting UL94V-0  
Cathode Band  
J
A
Maximum Ratings @ 25oC Unless Otherwise Specified  
C
Peak Surge  
Current  
IS  
See Table 1  
E
D
B
F
Maximum  
Forward  
VF  
1.2V  
(Note: 1)  
G
DIMENSIONS  
Voltage  
INCHES  
MIN  
.078  
.067  
.002  
---  
.035  
.065  
.205  
.160  
.100  
MM  
MIN  
1.98  
1.70  
.05  
---  
.89  
1.65  
5.21  
4.06  
2.57  
Steady State  
P(AV)  
1.0W  
(Note: 2,3)  
DIM  
A
B
C
D
E
MAX  
.116  
.089  
.008  
.02  
.055  
.096  
.224  
.180  
.112  
MAX  
2.95  
2.25  
.20  
NOTE  
Power  
Dissipation  
.51  
1.40  
2.45  
5.69  
4.57  
2.84  
TJ, TSTG -55oC to  
+150oC  
F
Operation And  
Storage  
G
H
J
Temperature  
*
SUGGESTED SOLDER  
PAD LAYOUT  
NOTES:  
0.090”  
1.  
2.  
3.  
Forward Current @ 200mA.  
Mounted on 4.0mm2 copper pads to each terminal.  
Lead temperature at 100oC or less. Derate linearly  
above 100oC to zero power at 150oC.  
0.085”  
0.070”  
www.mccsemi.com  

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