SM5820 - SM5822
SURFACE MOUNT SCHOTTKY BARRIER DIODES
VOLTAGE RANGE: 20 - 40V
CURRENT: 3.0 A
Features
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!
!
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Schottky Barrier Chip
Ideally Suited for Automatic Assembly
Low Power Loss, High Efficiency
For Use in Low Voltage Application
!
!
Guard Ring Die Construction
SMC/DO-214AB
Plastic Case Material has UL Flammability
B
Dim
A
Min
5.59
6.60
2.75
0.15
7.75
0.10
0.76
2.00
Max
6.22
7.11
3.18
0.31
8.13
0.20
1.52
2.62
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Mechanical Data
B
A
C
!
!
Case: SMC/DO-214AB, Molded Plastic
C
D
Terminals: Solder Plated, Solderable
per MIL-STD-750, Method 2026
E
D
G
H
J
!
!
Polarity: Cathode Band or Cathode Notch
Weight: 0.21 grams (approx.)
J
G
H
E
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
TA = 25ꢀC unless otherwise specified
For capacitive load, derate current by 20%.
Single phase, half wave, 60Hz, resistive or inductive load.
Unit
Characteristic
Symbol
SM5820
SM5821
SM5822
Maximumrecurrent peak reverse voltage
Maximum RMS voltage
20
14
20
30
21
30
40
28
40
V
V
V
VRRM
VRMS
VDC
Maximum DC blocking voltage
Maximum average forw ard rectified current
@TL=90
3.0
A
IF(AV)
Peak forw ard surge current
8.3ms single half-sine-w ave
IFSM
VF
IR
80.0
A
V
superimposed on rated load @TJ=125
Maximum instantaneous forw ard voltage @ 3.0A
0.475
0.85
0.50
0.90
2.0
0.525
0.95
(Note 1)
@ 9.4A
@TA=25
Maximumreverse current
mA
pF
at rated DC blocking voltage @TA=100
Typical junction capacitance (Note2)
20.0
250
20
CJ
RθJA
TJ
Typical thermal resistance
(Note3)
/W
Operating junction temperature range
Storage temperature range
- 55 ---- + 125
TSTG
- 55 ---- + 150
NOTE: 1. Pulse test : 300 s pulse width,1% duty cycle.
2. Measured at 1.0MHz and applied rev erse voltage of 4.0V DC.
3.Thermal resistance junction to ambient
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