Datasheet > SM5818PLHE3

SM5818PLHE3

更新时间： 2023-12-06 19:52:02

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美微科 - MCC		/
页数	文件大小	规格书
3页	907K
描述
Tape&Reel: 2.5Kpcs/Reel;

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数据手册

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SM5818PLHE3 数据手册

SM5817PLHE3 THRU SM5819PLHE3

Features

• Halogen Free. "Green" Device (Note 1)

• AEC-Q101 Qualified

• High Surge Capability

• Low Forward Voltage

• Low Profile Package

• Epoxy Meets UL 94 V-0 Flammability Rating

• Moisture Sensitivity Level 1

• Lead Free Finish/RoHS Compliant(Note 2) ("P" Suffix Designates

Compliant. See Ordering Information)

Schottky Barrier

Diodes

20 to 40 Volts

Maximum Ratings

• Operating Junction Temperature Range: -65⁰C to +125⁰C

• Storage Temperature Range: -65⁰C to +125⁰C

• Typical Thermal Resistance(Note3):88°C/W Junction to Ambient

• Typical Thermal Resistance(Note3):43°C/W Junction to Case

• Typical Thermal Resistance(Note3):30°C/W Junction to Lead

SOD-123FL

Maximum

Maximum DC

Recurrent

Peak Reverse

Voltage

MCC

Device

Maximum

RMS Voltage

Blocking

Voltage

Part Number

Marking

SM5817PLHE3

SM5818PLHE3

SM5819PLHE3

20V

30V

40V

14V

21V

28V

20V

30V

40V

Cathode Mark

Electrical Characteristics @ 25°C Unless Otherwise Speciﬁed

Average Forward Current

I_F(AV)

I_FRM

1.0A

T_L=90°C

Repetitive Peak Forward

Current

1.2A(Min)

1.5A(Max)

DIMENSIONS

INCHES

DIM

NOTE

Peak Forward Surge Current

I_FSM

t=8.3ms

30A

MIN MAX MIN MAX

0.130 0.152 3.30 3.85

0.100 0.122 2.55 3.10

0.055 0.075 1.40 1.90

0.035 0.053 0.90 1.35

0.020 0.041 0.50 1.05

Power Dissipation

Forward Voltage

P_D

1.14W

0.45V(Max) I_F=1A

0.53V(Max) I_F=1A

SM5817PLHE3

0.010

----

---- 0.010

0.25

----

0.25

SM5818PLHE3-5819PLHE3

I_F=0.1A

0.33V(Typ)

0.375V(Max)

0.45V(Max)

V_F

I_F=0.1A

I_F=0.5A

SUGGESTED SOLDER PAD LAYOUT

Maximum DC Reverse

Current At Rated DC

Blocking Voltage

2.36mm

T_J=25°C

T_J=100°C

V_R=15V

0.05mA

9.0mA

20µA

I_R

SM5818PLHE3-5819PLHE3

1.22mm

f=1.0MHz,

Vr=4V

Typical Junction Capacitance

C_J

50pF

Note: 1. Halogen free "Green” products are defined as those which contain <900ppm bromine,

0.91mm

<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

2. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7a.

3. Thermal Resistance:PC Board Mounted on 0.2*0.2''(5*5mm) copper pad area.

Rev.3-3-12012020

1/3

MCCSEMI.COM

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