SM360DT
Voltage 60V, 3.0Amp
Surface Mount Schottky Barrier Rectifiers
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen-free and RoHS Compliant
FEATURES
ꢀ
ꢀ
ꢀ
ꢀ
Heatsink Structure
Low Profile, Typical Thickness 0.8mm
Moisture Sensitivity: Level 1, Per J-STD-020
SOD-123DT
High Temperature Soldering Guaranteed: 260°C/10 Seconds
MARKING
PS36
PACKAGE INFORMATION
Package
MPQ
Leader Size
SOD-123DT
3K
7 inch
Millimeter
Millimeter
REF.
REF.
Min.
Max.
Min.
Max.
ORDER INFORMATION
A
B
C
D
E
2.9
1.9
0.75
3.5
3.1
2.1
0.9
3.9
0.25
F
G
H
I
0.85
0.6 REF.
0.4
1.66 REF.
1.05
Part Number
Type
Lead (Pb)-free
Lead (Pb)-free and Halogen-free
0.85
1.7
SM360DT
0.1
J
1.3
SM360DT-C
1
2
Anode
Cathode
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)
Rating
Parameter
Symbol
Unit
Typ.
Max.
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
VRRM
VRMS
VDC
IF
60
42
60
3
V
V
V
A
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
Peak Forward Surge Current@ 8.3 ms Single Half
Sine-Wave Superimposed on Rate Load
IFSM
I2t
100
A
Rating for Fusing (t<8.3ms)
41.7
A2S
IF=3A, TA=25°C
Instantaneous Forward Voltage
IF=3A, TA=125°C
0.61
0.52
4.1
0.65
0.6
50
VF
V
TA=25°C
uA
mA
pF
Instantaneous Reverse Current
IR
at Rated DC Blocking Voltage
TA=125°C
3.8
10
Typical Junction Capacitance
4V, 1MHz
CJ
RθJA
160
60
Typical Thermal Resistance from Junction to Ambient 1
Typical Thermal Resistance from Junction to Case 2
Typical Thermal Resistance from Junction to Lead 1
Operating Junction and Storage Temperature
°C/W
°C
RθJC
28
RθJL
6
TJ, TSTG
-55~150
Notes:
1.
The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads, 2 OZ, FR4 PCB.
The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads, 2 OZ, FR4 PCB.
2.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
09-Feb-2018 Rev. A
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