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SM360DT-C PDF预览

SM360DT-C

更新时间: 2024-01-23 01:18:40
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描述
Surface Mount Schottky Barrier Rectifiers

SM360DT-C 数据手册

 浏览型号SM360DT-C的Datasheet PDF文件第2页 
SM360DT  
Voltage 60V, 3.0Amp  
Surface Mount Schottky Barrier Rectifiers  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen-free and RoHS Compliant  
FEATURES  
Heatsink Structure  
Low Profile, Typical Thickness 0.8mm  
Moisture Sensitivity: Level 1, Per J-STD-020  
SOD-123DT  
High Temperature Soldering Guaranteed: 260°C/10 Seconds  
MARKING  
PS36  
PACKAGE INFORMATION  
Package  
MPQ  
Leader Size  
SOD-123DT  
3K  
7 inch  
Millimeter  
Millimeter  
REF.  
REF.  
Min.  
Max.  
Min.  
Max.  
ORDER INFORMATION  
A
B
C
D
E
2.9  
1.9  
0.75  
3.5  
3.1  
2.1  
0.9  
3.9  
0.25  
F
G
H
I
0.85  
0.6 REF.  
0.4  
1.66 REF.  
1.05  
Part Number  
Type  
Lead (Pb)-free  
Lead (Pb)-free and Halogen-free  
0.85  
1.7  
SM360DT  
0.1  
J
1.3  
SM360DT-C  
1
2
Anode  
Cathode  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)  
Rating  
Parameter  
Symbol  
Unit  
Typ.  
Max.  
Maximum Repetitive Peak Reverse Voltage  
Maximum RMS Voltage  
VRRM  
VRMS  
VDC  
IF  
60  
42  
60  
3
V
V
V
A
Maximum DC Blocking Voltage  
Maximum Average Forward Rectified Current  
Peak Forward Surge Current@ 8.3 ms Single Half  
Sine-Wave Superimposed on Rate Load  
IFSM  
I2t  
100  
A
Rating for Fusing (t<8.3ms)  
41.7  
A2S  
IF=3A, TA=25°C  
Instantaneous Forward Voltage  
IF=3A, TA=125°C  
0.61  
0.52  
4.1  
0.65  
0.6  
50  
VF  
V
TA=25°C  
uA  
mA  
pF  
Instantaneous Reverse Current  
IR  
at Rated DC Blocking Voltage  
TA=125°C  
3.8  
10  
Typical Junction Capacitance  
4V, 1MHz  
CJ  
RθJA  
160  
60  
Typical Thermal Resistance from Junction to Ambient 1  
Typical Thermal Resistance from Junction to Case 2  
Typical Thermal Resistance from Junction to Lead 1  
Operating Junction and Storage Temperature  
°C/W  
°C  
RθJC  
28  
RθJL  
6
TJ, TSTG  
-55~150  
Notes:  
1.  
The thermal resistance from junction to ambient or lead, mounted on P.C.B with 5×5mm copper pads, 2 OZ, FR4 PCB.  
The thermal resistance from junction to case, mounted on P.C.B with recommended copper pads, 2 OZ, FR4 PCB.  
2.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
09-Feb-2018 Rev. A  
Page 1 of 2  

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