SM3100DT
Voltage 100V, 3Amp
Surface Mount Schottky Barrier Rectifiers
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen-free and RoHS Compliant
FEATURES
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Heatsink Structure
Low Profile, Typical Thickness 0.8mm
Super Low VF Schottky Barrier Diodes
Moisture Sensitivity: Level 1, per J-STD-020
High Temperature Soldering Guaranteed: 260°C/10 seconds
SOD-123DT
MARKING
PS3100
PACKAGE INFORMATION
Package
MPQ
Leader Size
SOD-123DT
3K
7 inch
Millimeter
Millimeter
REF.
REF.
Min.
Max.
Min.
Max.
ORDER INFORMATION
A
B
C
D
E
2.9
1.9
0.75
3.5
3.1
2.1
0.9
3.9
0.25
F
G
H
I
0.85
0.6 REF.
0.4
1.66 REF.
1.05
Part Number
Type
Lead (Pb)-free
Lead (Pb)-free and Halogen-free
0.85
1.7
SM3100DT
0.1
J
1.3
SM3100DT-C
1
Cathode
2
Anode
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)
Parameter
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Symbol
VRRM
VRMS
VDC
Ratings
Unit
V
100
70
V
Maximum DC Blocking Voltage
100
3
V
Maximum Average Forward Rectified Current
IF
A
Peak Forward Surge Current @8.3ms Single Half Sine-Wave
Superimposed on Rate Load
IFSM
I2t
100
A
Rating for Fusing (t<8.3ms)
42
0.8
A2S
TA=25°C
Maximum Instantaneous Forward Voltage @IF=3A
TA=125°C
VF
V
0.65
5
TA=25°C
Maximum DC Reverse Current
IR
µA
pF
@ Rated DC Blocking Voltage
TA=125°C
1000
112
61
Typical Junction Capacitance
4V, 1MHz
CJ
RθJA
Typical Thermal Resistance from Junction-Ambient 1
Typical Thermal Resistance from Junction-Case 2
Typical Thermal Resistance from Junction-Lead 1
°C/W
°C
RθJC
31
RθJL
7
Operating Junction and Storage Temperature
Notes:
TJ, TSTG
-55~150
1.
2.
The thermal resistance from junction-ambient or lead, mounted on P.C.B with 5×5mm copper pads, 2OZ, FR4 PCB.
The thermal resistance from junction-case, mounted on P.C.B with recommended copper pads, 2OZ, FR4 PCB.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
02-May-2018 Rev. A
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