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SM260DT-C PDF预览

SM260DT-C

更新时间: 2024-01-06 23:56:47
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描述
Surface Mount Schottky Barrier Rectifiers

SM260DT-C 数据手册

 浏览型号SM260DT-C的Datasheet PDF文件第2页 
SM260DT  
Voltage 60V, 2Amp  
Surface Mount Schottky Barrier Rectifiers  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen-free and RoHS Compliant  
FEATURES  
Heatsink Structure  
Low Profile, Typical Thickness 0.8mm  
Low Forward Voltage Drop  
Super Low VF Schottky Barrier Diodes  
Moisture Sensitivity: Level 1, per J-STD-020  
High Temperature Soldering Guaranteed: 260°C/10 seconds  
SOD-123DT  
MARKING  
PS26  
PACKAGE INFORMATION  
Package  
MPQ  
Leader Size  
SOD-123DT  
3K  
7 inch  
Millimeter  
Millimeter  
REF.  
REF.  
Min.  
2.9  
Max.  
3.1  
Min.  
Max.  
ORDER INFORMATION  
A
B
C
D
E
F
G
H
I
0.85  
1.05  
1.9  
2.1  
0.6 REF.  
Part Number  
Type  
Lead (Pb)-free  
Lead (Pb)-free and Halogen-free  
0.75  
3.5  
0.9  
3.9  
0.4  
1.66 REF.  
1.3  
0.85  
1.7  
0.1  
0.25  
J
SM260DT  
SM260DT-C  
1
Cathode  
2
Anode  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise specified)  
Parameter  
Maximum Repetitive Peak Reverse Voltage  
Maximum RMS Voltage  
Symbol  
VRRM  
VRMS  
VDC  
Ratings  
Unit  
V
60  
42  
60  
2
V
Maximum DC Blocking Voltage  
V
Maximum Average Forward Rectified Current  
IF  
A
Peak Forward Surge Current @8.3ms Single Half Sine-Wave  
Superimposed on Rate Load  
IFSM  
I2t  
50  
A
Rating for Fusing (t<8.3ms)  
10  
0.65  
0.58  
50  
A2S  
TA=25°C  
Maximum Instantaneous Forward Voltage @IF=2A  
TA=125°C  
VF  
V
TA=25°C  
µA  
mA  
pF  
Maximum DC Reverse Current  
IR  
@Rated DC Blocking Voltage  
TA=125°C  
15  
Typical Junction Capacitance  
4V, 1MHz  
CJ  
RθJA  
95  
Typical Thermal Resistance from Junction-Ambient 1  
Typical Thermal Resistance from Junction-Case 2  
Typical Thermal Resistance from Junction-Lead 1  
60  
°C/W  
°C  
RθJC  
28  
RθJL  
6
Operating Junction and Storage Temperature  
Notes:  
TJ, TSTG  
-55~150  
1.  
2.  
The thermal resistance from junction-ambient or lead, mounted on P.C.B with 5×5mm copper pads, 2OZ, FR4 PCB.  
The thermal resistance from junction-case, mounted on P.C.B with recommended copper pads, 2OZ, FR4 PCB.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
05-Dec-2017 Rev. A  
Page 1 of 2  

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