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SM2029 PDF预览

SM2029

更新时间: 2024-11-25 06:12:03
品牌 Logo 应用领域
ABC /
页数 文件大小 规格书
6页 217K
描述
MULTILAYER CHIP BEAD

SM2029 数据手册

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SPECIFICATION FOR APPROVAL  
REF :  
PROD.  
NAME  
PAGE: 1  
ABC'S DWG NO.  
ABC'S ITEM NO.  
SM□□□□□□□□L-□□□  
MULTILAYER CHIP BEAD  
Ⅰ﹒CONFIGURATION & DIMENSIONS:  
A
D
D
I
G
I
( PCB Pattrn )  
B
C
Unit : m/m  
Series  
A
B
D
G
H
I
SM4532  
4.5±0.2  
3.2±0.2  
1.5±0.2  
0.60±0.4  
3.0  
3.0  
1.5  
SM4516  
SM3266  
SM3261  
SM2029  
SM1608  
4.5±0.2  
3.2±0.2  
3.2±0.2  
2.0±0.2  
1.6±0.2  
1.6±0.2  
1.6±0.2  
1.6±0.2  
1.2±0.2  
0.8±0.2  
1.6±0.2  
1.6±0.2  
1.1±0.2  
0.9±0.2  
0.8±0.2  
0.60±0.4  
0.60±0.4  
0.60±0.4  
0.50±0.3  
0.30±0.2  
3.0  
2.2  
2.2  
1.0  
0.7  
1.4  
1.4  
1.4  
1.0  
0.7  
1.5  
1.1  
1.1  
1.0  
0.7  
Ⅱ﹒SCHEMATIC DIAGRAM:  
Ⅲ﹒MATERIALS:  
a
b
c
aBodyFerrite  
bInternal conductorSilver or Ag / Pd  
cTerminal electrodeAg/Ni/Sn  
dRemarkProducts comply with RoHS' requirements  
Ⅳ﹒GENERAL SPECIFICATION:  
aStorage temp.-40---- +105℃  
bOperating temp.-55---- +125℃  
cTerminal Strength:  
Peak Temp260max.  
Max time above 230℃ :50sec max.  
Max time above 200℃ :70sec max.  
F
Temperature  
Rising Area  
Preheat Area  
Reflow Area  
Forced Cooling Area  
Type  
F ( kgf )  
time ( sec )  
+2.0 ~ 4.0  
/ sec max.  
+4.0/ sec max.  
150 ~ 200/ 60 ~ 120sec  
-(1.0 ~ 5.0)/ sec max.  
SM4532  
SM4516  
SM3261  
SM3266  
SM2029  
SM1608  
1.5  
1.0  
1.0  
1.0  
0.6  
0.5  
Peak Temperature:  
260  
250  
200  
150  
100  
50  
230℃  
50sec max.  
30±5  
70sec max.  
dSolderability:  
Solder : Sn96.5 / Ag3 / Cu0.5  
or equivalent  
Solder temp. : 260±5℃  
Flux : Rosin  
Dip time : 4±1 seconds  
50  
100  
150  
Time ( seconds )  
200  
250  
0
AR-001A  

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