SLD80R380SJ,SLU80R380SJ,SLP80R380SJ
SLF80R380SJ,SLB80R380SJ, SLI80R380SJ
800V N-Channel MOSFET
Features
-15A, 800V, RDS(on) typ.= 0.34Ω@VGS = 10 V
General Description
Features
This Power MOSFET is produced using Maple semi‘s
Advanced Super-Junction technology.
- Low gate charge ( typical 43nC)
- High ruggedness
- 7.6A, 500V, RDS(on) typ. = 0.5Ω@VGS = 10 V
This advanced technology has-bLoewegnatee schpaergcei(atlylpyictaal i2lo5nrCe)d
- High ruggedness
- Fast switching
to minimize conduction loss, provide superior switching
- Fast switching
performance, and withstand high energy pulse in the
- 100% avalanche tested
- 100% avalanche tested
- Improved dv/dt capability
avalanche and commutation mode.
- Improved dv/dt capability
These devices are well suited for AC/DC power conversion
D
D
I2-PAK
TO-220
TO-220F
G D S
G D S
G D S
G
D
D
I-PAK
D-PAK
S
D2-PAK
G
S
G
D S
G
S
Absolute Maximum Ratings
TC = 25°C unless otherwise noted
D2-PAK/D-PAK
I2-PAK / I-PAK/ TO-220
800
Symbol
VDSS
ID
Parameter
TO-220F
Units
Drain-Source Voltage
Drain Current
V
A
- Continuous (TC = 25℃)
- Continuous (TC = 100℃)
(Note 1)
15
8.9
42
15*
8.9*
42*
A
IDM
VGSS
EAS
IAR
Drain Current - Pulsed
Gate-Source Voltage
A
±30
284
2.4
V
Single Pulsed Avalanche Energy
Avalanche Current
(Note 2)
(Note 1)
(Note 1)
(Note 3)
mJ
A
EAR
dv/dt
Repetitive Avalanche Energ
Peak Diode Recovery dv/dt
Power Dissipation (TC = 25℃)
0.43
15
mJ
V/ns
W
104
32
PD
W/℃
℃
- Derate above 25℃
Operating and Storage Temperature Range
0.83
0.27.5
TJ, TSTG
TL
-55 to +150
300
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
℃
*Drain current limited by maximum junction temperature.
Thermal Characteristics
Value
Symbol
Parameter
Units
DPAK
1.2
-
IPAK
1.2
TO220
D2PAK
I2PAK
TO220F
RθJC
RθJS
RθJA
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink Typ.
Thermal Resistance, Junction-to-Ambient
1.2
0.5
62
1.2
1.2
0.5
62
3.9
-
℃/W
℃/W
℃/W
-
0.5
62
62
62
80
Maple Semiconductor CO.,LTD
http://www.maplesemi.com
Rev 1.0 September 2015
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