SL22F THRU SL210F
Reverse Voltage - 40 to 60 Volts Forward Current - 2.0 Ampere
SURFACE MOUNT SCHOTTKY BARRIER DIODES
SMAF
Features
The plastic package carries Underwriters Laboratory
0.106(2.70)
0.094(2.40)
0.063 (1.60)
0.051 (1.30)
Flammability Classification 94V-0 RoHS-compliant
I dea for printed circuit board
Open Junction chip
0.146(3.70)
0.130(3.30)
Low reverse leakage High forward surge current
capability High temperature soldering guaranteed
250℃/10 seconds at terminals
0.047(1.20)
0.035(0.90)
0.008(0.20)
0.005(0.12)
0.047(1.20)
0.031(0.80)
Mechanical Data
0.193(4.90)
0.173(4.40)
Cas e : SMAF molded plastic body
Terminals : Solderable per MIL-STD-750,Method 2026
Polarity : Polarity symbol marking on body
Mounting Pos ition : Any
Dimensions in inches and (millimeters)
Weight
: 0.00095 ounce, 0.027 grams
Maximum Ratings And Electrical Characteristics
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
MDD
SL22F
MDD
SL24F
MDD
SL26F
MDD
SL28F
MDD
SL210F
SYMBOLS
UNITS
Marking Code
28
40
40
42
60
60
56
80
80
70
100
100
14
20
20
V
RRM
RMS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
V
V
V
Maximum DC blocking voltage
VDC
Maximum average forward rectified current
at TL(see fig.1)
I(AV)
2.0
A
Peak forward surge current
50
I
FSM
8.3ms single half sine-wave
A
V
superimposed onrated load (JEDEC Method)
Maximum instantaneous forward voltage at 2.0A
VF
0.45
0.5
0.7
0.5
10.0
0.2
5.0
Maximum DCreversecurrent
at rated DCblocking voltage
T
A
=25
℃
IR
mA
pF
TA=125℃
220
180
Typical junction capacitance (NOTE 1)
Typical thermal resistance (NOTE 2)
Operating junction temperature range
Storage temperature range
C
J
90.0
℃/
W
RθJA
-55 to +125
℃
℃
-55 to +150
TJ
-55 to +150
TSTG
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas
DN:T20515A0
http://www.microdiode.com
Rev:2020A0
Page :1