SKM900GA12E4
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Unit
Tj = 25 °C
VCES
IC
1200
1305
1003
900
2700
V
A
A
A
A
V
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
ICnom
ICRM
VGES
ICRM = 3xICnom
-20 ... 20
SEMITRANS® 4
IGBT4 Modules
SKM900GA12E4
Features
VCC = 800 V
VGE ≤ 15 V
Tj = 150 °C
tpsc
10
µs
°C
VCES ≤ 1200 V
Tj
-40 ... 175
Inverse diode
Tc = 25 °C
Tc = 80 °C
IF
871
651
800
2400
3520
A
A
A
A
A
Tj = 175 °C
IFnom
IFRM
IFSM
Tj
IFRM = 3xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
ꢀ IGBT4 = 4. generation medium fast
trench IGBT (Infineon)
-40 ... 175
°C
Module
It(RMS)
Tstg
ꢀ CAL4 = Soft switching 4. generation
CAL-diode
Tterminal = 80 °C
500
-40 ... 125
4000
A
°C
V
ꢀ Isolated copper baseplate using DBC
technology (Direct Bonded Copper)
ꢀ Increased power cycling capability
ꢀ With integrated gate resistor
ꢀ For higher switching frequenzies up to
12kHz
Visol
AC sinus 50 Hz, t = 1 min
Characteristics
Symbol Conditions
IGBT
min.
typ.
max.
Unit
ꢀ UL recognized, file no. E63532
Typical Applications*
IC = 900 A
Tj = 25 °C
VCE(sat)
1.83
2.23
2.08
2.44
V
V
ꢀ AC inverter drives
ꢀ UPS
V
GE = 15 V
Tj = 150 °C
chiplevel
ꢀ Switched reluctance motor
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
0.8
0.7
1.14
1.70
5.8
0.9
0.8
1.31
1.82
6.5
5
V
V
mΩ
mΩ
V
mA
mA
nF
nF
nF
nC
Ω
chiplevel
Remarks
ꢀ Case temperature limited
to Tc = 125°C max.
ꢀ Recommended Top = -40 ... +150°C
ꢀ Product reliability results valid
for Tj = 150°C
VGE = 15 V
chiplevel
VGE(th)
ICES
VGE=VCE, IC = 32.8 mA
Tj = 25 °C
5
VGE = 0 V
CE = 1200 V
V
Tj = 150 °C
f = 1 MHz
f = 1 MHz
f = 1 MHz
Cies
Coes
Cres
QG
RGint
td(on)
tr
Eon
td(off)
tf
54.4
3.52
3.00
5000
0.9
220
112
130
652
139
VCE = 25 V
GE = 0 V
V
VGE = - 8 V...+ 15 V
Tj = 25 °C
VCC = 600 V
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
ns
ns
mJ
ns
ns
I
C = 900 A
V
GE = +15/-15 V
R
R
G on = 1 Ω
G off = 1 Ω
di/dton = 6900 A/µs
di/dtoff = 5600 A/µs
Tj = 150 °C
Eoff
121
mJ
Rth(j-c)
per IGBT
0.035
K/W
GA
© by SEMIKRON
Rev. 3 – 09.07.2014
1