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SKM400GB12F4 PDF预览

SKM400GB12F4

更新时间: 2023-12-06 20:09:22
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON /
页数 文件大小 规格书
7页 622K
描述
Chips SEMITRANS 3 (106x62x31)

SKM400GB12F4 技术参数

生命周期:ActiveReach Compliance Code:compliant
风险等级:5.63Base Number Matches:1

SKM400GB12F4 数据手册

 浏览型号SKM400GB12F4的Datasheet PDF文件第2页浏览型号SKM400GB12F4的Datasheet PDF文件第3页浏览型号SKM400GB12F4的Datasheet PDF文件第4页浏览型号SKM400GB12F4的Datasheet PDF文件第5页浏览型号SKM400GB12F4的Datasheet PDF文件第6页浏览型号SKM400GB12F4的Datasheet PDF文件第7页 
SKM400GB12F4  
Absolute Maximum Ratings  
Symbol Conditions  
IGBT  
Values  
Unit  
Tj = 25 °C  
VCES  
IC  
1200  
548  
418  
400  
800  
V
A
A
A
A
V
Tc = 25 °C  
Tc = 80 °C  
Tj = 175 °C  
ICnom  
ICRM  
VGES  
ICRM = 2 x ICnom  
VCC = 800 V  
-20 ... 20  
SEMITRANS® 3  
High Speed IGBT4 Modules  
SKM400GB12F4  
V
V
GE 15 V  
Tj = 150 °C  
tpsc  
10  
µs  
°C  
CES 1200 V  
R
G on/off 3 Ω  
Tj  
Inverse diode  
Tj = 25 °C  
-40 ... 175  
VRRM  
IF  
1200  
402  
295  
V
A
A
Tc = 25 °C  
Tc = 80 °C  
Tj = 175 °C  
Features*  
• High speed trench and field-stop IGBT  
• CAL4 ultra-fast = soft switching 4.  
generation CAL-diode  
IFnom  
IFRM  
IFSM  
Tj  
400  
800  
1980  
-40 ... 175  
A
A
A
°C  
IFRM = 2xIFnom  
tp = 10 ms, sin 180°, Tj = 25 °C  
• Insulated copper baseplate using DBC  
technology (Direct Bonded Copper)  
• Increased power cycling capability  
• For higher switching frequencies above  
15kHz  
Module  
It(RMS)  
Tstg  
500  
-40 ... 125  
4000  
A
°C  
V
module without TIM  
AC sinus 50 Hz, t = 1 min  
Visol  
• UL recognized, file no. E63532  
Typical Applications  
Characteristics  
• UPS  
Symbol Conditions  
IGBT  
min.  
typ.  
max.  
Unit  
• Electronic welders  
• Inductive heating  
• Switched mode power supplies  
IC = 400 A  
Tj = 25 °C  
VCE(sat)  
2.06  
2.59  
2.44  
2.97  
V
V
V
GE = 15 V  
Remarks  
• Case temperature limited  
to Tc = 125°C max.  
• Recommended Top = -40 ... +150°C  
• Product reliability results valid  
for Tj = 150°C  
Tj = 150 °C  
chiplevel  
Tj = 25 °C  
Tj = 150 °C  
Tj = 25 °C  
Tj = 150 °C  
VCE0  
rCE  
1.10  
0.95  
2.4  
4.1  
5.8  
1.28  
1.13  
2.9  
4.6  
6.4  
5
V
V
mΩ  
mΩ  
V
mA  
nF  
nF  
nF  
nC  
Ω
chiplevel  
VGE = 15 V  
chiplevel  
VGE(th)  
ICES  
Cies  
Coes  
Cres  
QG  
VGE=VCE, IC = 15.2 mA  
VGE = 0 V, VCE = 1200 V, Tj = 25 °C  
f = 1 MHz  
5.1  
24.6  
1.62  
1.38  
2268  
1.6  
VCE = 25 V  
f = 1 MHz  
f = 1 MHz  
V
GE = 0 V  
VGE = - 8 V...+ 15 V  
Tj = 25 °C  
RGint  
td(on)  
tr  
Eon  
td(off)  
tf  
VCC = 600 V  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
110  
55  
28  
415  
75  
ns  
ns  
mJ  
ns  
ns  
I
C = 400 A  
V
R
R
GE = +15/-15 V  
G on = 2 Ω  
G off = 1 Ω  
di/dton = 7960 A/µs  
di/dtoff = 4430 A/µs  
dv/dt = 4530 V/µs  
Tj = 150 °C  
Eoff  
32  
mJ  
Rth(j-c)  
Rth(c-s)  
per IGBT  
per IGBT (λgrease=0.81 W/(m*K))  
0.072  
K/W  
K/W  
0.041  
GB  
© by SEMIKRON  
Rev. 1.0 – 29.01.2020  
1

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