SKM400GAR12V
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Unit
Tj = 25 °C
VCES
IC
1200
612
467
400
1200
-20 ... 20
V
A
A
A
A
V
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
ICnom
ICRM
VGES
ICRM = 3xICnom
SEMITRANS® 3
VCC = 720 V
VGE ≤ 15 V
VCES ≤ 1200 V
Tj = 125 °C
tpsc
10
µs
°C
Tj
-40 ... 175
Inverse diode
Tc = 25 °C
Tc = 80 °C
IF
440
329
400
1200
1980
A
A
A
A
A
Tj = 175 °C
SKM400GAR12V
Features
IFnom
IFRM
IFSM
Tj
IFRM = 3xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
ꢀ V-IGBT = 6. Generation Trench V-IGBT
(Fuji)
-40 ... 175
°C
Freewheeling diode
IF
ꢀ CAL4 = Soft switching 4. Generation
CAL-diode
Tc = 25 °C
Tc = 80 °C
440
329
400
1200
1980
A
A
A
A
A
Tj = 175 °C
ꢀ Isolated copper baseplate using DBC
technology (Direct Copper Bonding)
ꢀ UL recognized, file no. E63532
ꢀ Increased power cycling capability
ꢀ With integrated gate resistor
ꢀ Low switching losses at high di/dt
IFnom
IFRM
IFSM
Tj
IFRM = 3xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
-40 ... 175
°C
Typical Applications*
Module
It(RMS)
Tstg
ꢀ Electronic welders
ꢀ DC/DC – converter
ꢀ Brake chopper
Tterminal = 80 °C
500
-40 ... 125
4000
A
°C
V
Visol
AC sinus 50 Hz, t = 1 min
ꢀ Switched reluctance motor
Remarks
Characteristics
ꢀ Case temperature limited to
Tc = 125°C max, recomm.
Symbol Conditions
IGBT
min.
typ.
max.
Unit
Top = -40 ... +150°C, product
IC = 400 A
rel. results valid for Tj = 150°
Tj = 25 °C
VCE(sat)
1.75
2.20
2.20
2.50
V
V
V
GE = 15 V
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
0.94
0.88
2.02
3.30
6
1.04
0.98
2.90
3.80
6.5
V
V
m
m
V
mA
mA
nF
nF
nF
nC
chiplevel
VGE = 15 V
chiplevel
VGE(th)
ICES
VGE=VCE, IC = 16 mA
Tj = 25 °C
5.5
0.1
0.3
VGE = 0 V
CE = 1200 V
V
Tj = 150 °C
f = 1 MHz
f = 1 MHz
f = 1 MHz
Cies
Coes
Cres
QG
24.0
2.36
2.36
4400
1.88
VCE = 25 V
GE = 0 V
V
VGE = - 8 V...+ 15 V
RGint
GAR
© by SEMIKRON
Rev. 0 – 19.07.2012
1