SKM300GB07E3
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Unit
Tj = 25 °C
VCES
IC
650
394
297
300
900
V
A
A
A
A
V
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
ICnom
ICRM
VGES
ICRM = 3 x ICnom
VCC = 360 V
-20 ... 20
SEMITRANS® 3
Trench IGBT Modules
SKM300GB07E3
V
V
GE ≤ 15 V
CES ≤ 650 V
Tj = 150 °C
tpsc
6
µs
°C
Tj
-40 ... 175
Inverse diode
Tj = 25 °C
VRRM
IF
650
335
244
V
A
A
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
IFnom
IFRM
IFSM
Tj
300
600
2160
-40 ... 175
A
A
A
°C
Features*
IFRM = 2xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
• VCE(sat) with positive temperature
coefficient
• High short circuit capability, self limiting
to 6 x Icnom
• Fast & soft inverse CAL diodes
• Insulated copper baseplate using DBC
Technology (Direct Copper Bonding)
• With integrated gate resistor
Module
It(RMS)
Tstg
500
-40 ... 125
4000
A
°C
V
module without TIM
AC sinus 50 Hz, t = 1 min
Visol
Typical Applications
Characteristics
• AC inverter drives
• UPS
Symbol Conditions
IGBT
min.
typ.
max.
Unit
Remarks
• Case temperature limited
to Tc = 125°C max.
IC = 300 A
Tj = 25 °C
VCE(sat)
1.45
1.69
1.90
2.10
V
V
V
GE = 15 V
Tj = 150 °C
chiplevel
• Recommended Top = -40 ... +150°C
• Product reliability results valid
for Tj = 150°C
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
0.90
0.82
1.83
2.9
1.00
0.90
3.0
4.0
6.4
V
V
mΩ
mΩ
V
mA
nF
nF
nF
nC
Ω
chiplevel
• Use of soft RG necessary
VGE = 15 V
chiplevel
VGE(th)
ICES
Cies
Coes
Cres
QG
VGE=VCE, IC = 4.8 mA
VGE = 0 V, VCE = 650 V, Tj = 25 °C
f = 1 MHz
5.1
5.8
0.3
18.5
1.16
0.55
2400
1.0
VCE = 25 V
f = 1 MHz
f = 1 MHz
V
GE = 0 V
VGE = - 8 V...+ 15 V
Tj = 25 °C
RGint
td(on)
tr
Eon
td(off)
tf
VCC = 300 V
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
157
58
4.7
813
67
ns
ns
mJ
ns
ns
I
C = 300 A
V
R
R
GE = +15/-7.5 V
G on = 2 Ω
G off = 5.6 Ω
di/dton = 6100 A/µs
di/dtoff = 4500 A/µs
dv/dt = 1700 V/µs
Ls = 22 nH
Tj = 150 °C
Eoff
13.6
mJ
Rth(j-c)
Rth(c-s)
per IGBT
per IGBT (λgrease=0.81 W/(m*K))
per IGBT, pre-applied phase change
material
0.15
K/W
K/W
0.042
0.038
Rth(c-s)
K/W
GB
© by SEMIKRON
Rev. 2.0 – 28.05.2019
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