SKM300GAR07E3
Absolute Maximum Ratings
Symbol Conditions
IGBT
Values
Unit
Tj = 25 °C
VCES
IC
650
382
297
300
900
V
A
A
A
A
V
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
ICnom
ICRM
VGES
ICRM = 3xICnom
VCC = 360 V
-20 ... 20
SEMITRANS® 3
V
V
GE ≤ 15 V
CES ≤ 650 V
Tj = 150 °C
tpsc
6
µs
°C
Tj
-40 ... 175
Trench IGBT Modules
Inverse diode
Tj = 25 °C
VRRM
IF
650
335
V
A
SKM300GAR07E3
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
244
A
Target Data
IFnom
IFRM
IFSM
Tj
300
A
Features
IFRM = 2xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
600
A
• VCE(sat) with positive temperature
coefficient
2160
-40 ... 175
A
°C
• High short circuit capability, self limiting
to 6 x Icnom
Freewheeling diode
• Fast & soft inverse CAL diodes
• Insulated copper baseplate using DBC
Technology (Direct Copper Bonding)
• With integrated gate resistor
Tj = 25 °C
VRRM
IF
650
335
V
A
Tc = 25 °C
Tc = 80 °C
Tj = 175 °C
244
A
IFnom
IFRM
IFSM
Tj
300
600
2160
-40 ... 175
A
A
A
°C
Typical Applications*
IFRM = 2xIFnom
tp = 10 ms, sin 180°, Tj = 25 °C
• Electronic welders
• DC/DC – converter
• Brake chopper
• Switched reluctance motor
Module
It(RMS)
Tstg
500
-40 ... 125
4000
A
°C
V
Remarks
• Case temperature limited
to Tc = 125°C max.
module without TIM
AC sinus 50 Hz, t = 1 min
Visol
• Recommended Top = -40 ... +150°C
• Product reliability results valid
for Tj = 150°C
Characteristics
Symbol Conditions
IGBT
min.
typ.
max.
Unit
• Use of soft RG necessary
IC = 300 A
Tj = 25 °C
VCE(sat)
1.45
1.69
1.90
2.10
V
V
V
GE = 15 V
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
0.90
0.82
1.83
2.9
1.00
0.90
3.0
4.0
6.4
V
V
mΩ
mΩ
V
mA
mA
nF
nF
nF
nC
Ω
chiplevel
VGE = 15 V
chiplevel
VGE(th)
ICES
VGE=VCE, IC = 4.8 mA
Tj = 25 °C
5.1
5.8
0.3
VGE = 0 V
CE = 650 V
V
Tj = 150 °C
f = 1 MHz
f = 1 MHz
f = 1 MHz
-
Cies
Coes
Cres
QG
18.5
1.16
0.55
2400
1.0
VCE = 25 V
GE = 0 V
V
VGE = - 8 V...+ 15 V
Tj = 25 °C
RGint
GAR
© by SEMIKRON
Rev. 1.1 – 10.07.2018
1