SKiM459GD12F4V3
Absolute Maximum Ratings
Symbol Conditions
Inverter - IGBT
Values
Unit
Tj = 25 °C
VCES
IC
1200
589
476
687
558
450
1350
-20 ... 20
V
A
A
A
A
A
A
V
Ts = 25 °C
Ts = 70 °C
Ts = 25 °C
Ts = 70 °C
λpaste=0.8 W/(mK)
Tj = 175 °C
IC
λpaste=2.5 W/(mK)
Tj = 175 °C
ICnom
ICRM
VGES
SKiM® 93
VCC = 800 V
Hybrid SiC Trench IGBT
Modules
tpsc
V
V
GE ≤ 15 V
Tj = 150 °C
10
µs
°C
CES ≤ 1200 V
Tj
-40 ... 175
Inverse - Diode
Tj = 25 °C
SKiM459GD12F4V3
VRRM
IF
1200
220
177
233
188
250
529 1)
-40 ... 175
V
A
A
A
A
A
A
°C
Ts = 25 °C
Ts = 70 °C
Ts = 25 °C
Ts = 70 °C
λpaste=0.8 W/(mK)
Tj = 175 °C
Features*
• IGBT 4 Fast
• SiC Schottky free-wheeling diodes, 3
diodes per switch
IF
λpaste=2.5 W/(mK)
Tj = 175 °C
IFRM
IFSM
Tj
tp = 10 ms, sin 180°, Tj = 150 °C
• Solderless sinter technology
• VCE(sat) with positive temperature
coefficient
Module
It(RMS)
Tstg
• Low inductance case
Tterminal = 80 °C,
700
-40 ... 125
2500
A
°C
V
• Insulated by Al2O3 DBC (Direct Bonded
Copper) ceramic substrate
• Pressure contact technology for
thermal contacts
Visol
AC sinus 50 Hz, t = 1 min
• Spring contact system to attach driver
PCB to the control terminals
• High short circuit capability
• Integrated temperature sensor
• UL recognized: File no. E63532
Characteristics
Symbol Conditions
Inverter - IGBT
min.
typ.
max.
Unit
IC = 450 A
Tj = 25 °C
VCE(sat)
2.05
2.59
2.42
2.96
V
V
V
GE = 15 V
Typical Applications
• UPS (inv., rect.)
• Energy storage
• Active front-end
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
1.10
0.95
2.1
3.6
5.8
1.28
1.13
2.5
4.1
6.4
3
V
V
mΩ
mΩ
V
mA
nF
nF
nF
nC
Ω
ns
ns
mJ
ns
ns
chiplevel
VGE = 15 V
chiplevel
Remarks
• Case temperature limited to Ts = 125°C
max; Tc = Ts (for baseplateless
modules)
VGE(th)
ICES
Cies
Coes
Cres
QG
RGint
td(on)
tr
VGE = VCE, IC = 15.6 mA
VGE = 0 V, VCE = 1200 V, Tj = 25 °C
f = 1 MHz
5.2
26.4
1.74
1.41
2550
1.7
231
27
2
VCE = 25 V
Footnotes
f = 1 MHz
f = 1 MHz
V
GE = 0 V
IFSM value is valid for SiC Schottky diode in
combination with IGBT, please see
Technical Explanations SKiM63/93 for
further details
VGE = - 8 V...+ 15 V
Tj = 25 °C
VCC = 600 V
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
I
C = 120 A
R
R
G on = 1 Ω
G off = 1 Ω
Eon
td(off)
tf
595
75
di/dton = 4800 A/µs
di/dtoff = 1730 A/µs
dv/dt = 2550 V/µs
V
GE = +15/-15 V
Tj = 150 °C
Eoff
11
mJ
Ls = 24 nH
per IGBT, λpaste=0.8 W/(mK)
per IGBT, λpaste=2.5 W/(mK)
Rth(j-s)
Rth(j-s)
0.069
0.053
K/W
K/W
GD
© by SEMIKRON
Rev. 3.0 – 20.09.2021
1