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SKiM459GD12F4V3 PDF预览

SKiM459GD12F4V3

更新时间: 2024-11-13 14:55:51
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赛米控丹佛斯 - SEMIKRON /
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6页 910K
描述
SiC Modules SKIM 93 (160x150x35)

SKiM459GD12F4V3 数据手册

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SKiM459GD12F4V3  
Absolute Maximum Ratings  
Symbol Conditions  
Inverter - IGBT  
Values  
Unit  
Tj = 25 °C  
VCES  
IC  
1200  
589  
476  
687  
558  
450  
1350  
-20 ... 20  
V
A
A
A
A
A
A
V
Ts = 25 °C  
Ts = 70 °C  
Ts = 25 °C  
Ts = 70 °C  
λpaste=0.8 W/(mK)  
Tj = 175 °C  
IC  
λpaste=2.5 W/(mK)  
Tj = 175 °C  
ICnom  
ICRM  
VGES  
SKiM® 93  
VCC = 800 V  
Hybrid SiC Trench IGBT  
Modules  
tpsc  
V
V
GE 15 V  
Tj = 150 °C  
10  
µs  
°C  
CES 1200 V  
Tj  
-40 ... 175  
Inverse - Diode  
Tj = 25 °C  
SKiM459GD12F4V3  
VRRM  
IF  
1200  
220  
177  
233  
188  
250  
529 1)  
-40 ... 175  
V
A
A
A
A
A
A
°C  
Ts = 25 °C  
Ts = 70 °C  
Ts = 25 °C  
Ts = 70 °C  
λpaste=0.8 W/(mK)  
Tj = 175 °C  
Features*  
• IGBT 4 Fast  
• SiC Schottky free-wheeling diodes, 3  
diodes per switch  
IF  
λpaste=2.5 W/(mK)  
Tj = 175 °C  
IFRM  
IFSM  
Tj  
tp = 10 ms, sin 180°, Tj = 150 °C  
• Solderless sinter technology  
• VCE(sat) with positive temperature  
coefficient  
Module  
It(RMS)  
Tstg  
• Low inductance case  
Tterminal = 80 °C,  
700  
-40 ... 125  
2500  
A
°C  
V
• Insulated by Al2O3 DBC (Direct Bonded  
Copper) ceramic substrate  
• Pressure contact technology for  
thermal contacts  
Visol  
AC sinus 50 Hz, t = 1 min  
• Spring contact system to attach driver  
PCB to the control terminals  
• High short circuit capability  
• Integrated temperature sensor  
• UL recognized: File no. E63532  
Characteristics  
Symbol Conditions  
Inverter - IGBT  
min.  
typ.  
max.  
Unit  
IC = 450 A  
Tj = 25 °C  
VCE(sat)  
2.05  
2.59  
2.42  
2.96  
V
V
V
GE = 15 V  
Typical Applications  
• UPS (inv., rect.)  
• Energy storage  
• Active front-end  
Tj = 150 °C  
chiplevel  
Tj = 25 °C  
Tj = 150 °C  
Tj = 25 °C  
Tj = 150 °C  
VCE0  
rCE  
1.10  
0.95  
2.1  
3.6  
5.8  
1.28  
1.13  
2.5  
4.1  
6.4  
3
V
V
mΩ  
mΩ  
V
mA  
nF  
nF  
nF  
nC  
Ω
ns  
ns  
mJ  
ns  
ns  
chiplevel  
VGE = 15 V  
chiplevel  
Remarks  
• Case temperature limited to Ts = 125°C  
max; Tc = Ts (for baseplateless  
modules)  
VGE(th)  
ICES  
Cies  
Coes  
Cres  
QG  
RGint  
td(on)  
tr  
VGE = VCE, IC = 15.6 mA  
VGE = 0 V, VCE = 1200 V, Tj = 25 °C  
f = 1 MHz  
5.2  
26.4  
1.74  
1.41  
2550  
1.7  
231  
27  
2
VCE = 25 V  
Footnotes  
f = 1 MHz  
f = 1 MHz  
V
GE = 0 V  
IFSM value is valid for SiC Schottky diode in  
combination with IGBT, please see  
Technical Explanations SKiM63/93 for  
further details  
VGE = - 8 V...+ 15 V  
Tj = 25 °C  
VCC = 600 V  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
I
C = 120 A  
R
R
G on = 1 Ω  
G off = 1 Ω  
Eon  
td(off)  
tf  
595  
75  
di/dton = 4800 A/µs  
di/dtoff = 1730 A/µs  
dv/dt = 2550 V/µs  
V
GE = +15/-15 V  
Tj = 150 °C  
Eoff  
11  
mJ  
Ls = 24 nH  
per IGBT, λpaste=0.8 W/(mK)  
per IGBT, λpaste=2.5 W/(mK)  
Rth(j-s)  
Rth(j-s)  
0.069  
0.053  
K/W  
K/W  
GD  
© by SEMIKRON  
Rev. 3.0 – 20.09.2021  
1

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