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SKiM459GD12E4 V2 PDF预览

SKiM459GD12E4 V2

更新时间: 2024-11-26 14:55:47
品牌 Logo 应用领域
赛米控丹佛斯 - SEMIKRON 双极性晶体管
页数 文件大小 规格书
6页 875K
描述
IGBT Modules SKIM 93 (160x150x35)

SKiM459GD12E4 V2 数据手册

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SKiM459GD12E4 V2  
Absolute Maximum Ratings  
Symbol Conditions  
Inverter - IGBT  
Values  
Unit  
Tj = 25 °C  
VCES  
IC  
1200  
554  
450  
714  
583  
450  
1350  
-20 ... 20  
V
A
A
A
A
A
A
V
Ts = 25 °C  
Ts = 70 °C  
Ts = 25 °C  
Ts = 70 °C  
λpaste=0.8 W/(mK)  
Tj = 175 °C  
IC  
λpaste=2.5 W/(mK)  
Tj = 175 °C  
ICnom  
ICRM  
VGES  
SKiM® 93  
VCC = 800 V  
Trench IGBT Modules  
SKiM459GD12E4 V2  
Features*  
tpsc  
V
V
GE 15 V  
Tj = 150 °C  
10  
µs  
°C  
CES 1200 V  
Tj  
-40 ... 175  
Inverse - Diode  
Tj = 25 °C  
VRRM  
IF  
1200  
438  
347  
530  
422  
1350  
2430  
-40 ... 175  
V
A
A
A
A
A
A
°C  
Ts = 25 °C  
Ts = 70 °C  
Ts = 25 °C  
Ts = 70 °C  
λpaste=0.8 W/(mK)  
Tj = 175 °C  
• IGBT 4 Trench Gate Technology  
• Solderless sinter technology  
• VCE(sat) with positive temperature  
coefficient  
IF  
λpaste=2.5 W/(mK)  
Tj = 175 °C  
IFRM  
IFSM  
Tj  
• Low inductance case  
tp = 10 ms, sin 180°, Tj = 150 °C  
• Insulated by Al2O3 DBC (Direct Bonded  
Copper) ceramic substrate  
• Pressure contact technology for  
thermal contacts  
Module  
It(RMS)  
Tstg  
Tterminal = 80 °C,  
700  
-40 ... 125  
2500  
A
°C  
V
• Spring contact system to attach driver  
PCB to the control terminals  
• High short circuit capability, self limiting  
to 6 x IC  
• Integrated temperature sensor  
• Improved power cycle capability of  
diodes due to AlCu-bond wires  
Visol  
AC sinus 50 Hz, t = 1 min  
Characteristics  
Symbol Conditions  
Inverter - IGBT  
min.  
typ.  
max.  
Unit  
Typical Applications  
IC = 450 A  
Tj = 25 °C  
VCE(sat)  
1.85  
2.25  
2.10  
2.45  
V
V
V
GE = 15 V  
• Automotive inverter  
Tj = 150 °C  
chiplevel  
• High reliability AC inverter wind  
• High reliability AC inverter drives  
Tj = 25 °C  
Tj = 150 °C  
Tj = 25 °C  
Tj = 150 °C  
VCE0  
rCE  
0.80  
0.70  
2.3  
3.4  
5.8  
0.90  
0.80  
2.7  
3.7  
6.5  
V
V
mΩ  
mΩ  
V
mA  
nF  
nF  
nF  
nC  
Ω
ns  
ns  
mJ  
ns  
ns  
chiplevel  
VGE = 15 V  
chiplevel  
Remarks  
VGE(th)  
ICES  
Cies  
Coes  
Cres  
QG  
RGint  
td(on)  
tr  
VGE = VCE, IC = 18 mA  
VGE = 0 V, VCE = 1200 V, Tj = 25 °C  
f = 1 MHz  
5
• Case temperature limited to Ts = 125°C  
max; Tc = Ts (for baseplateless  
modules)  
0.3  
26.4  
1.74  
1.41  
2550  
1.7  
276  
55  
22  
VCE = 25 V  
f = 1 MHz  
f = 1 MHz  
• Recommended Tj,op = -40 … +150°C  
V
GE = 0 V  
VGE = - 8 V...+ 15 V  
Tj = 25 °C  
VCC = 600 V  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
Tj = 150 °C  
I
C = 450 A  
R
R
G on = 1.3 Ω  
G off = 1.3 Ω  
Eon  
td(off)  
tf  
538  
114  
di/dton = 8340 A/µs  
di/dtoff = 3660 A/µs  
VGE = +15/-15 V  
Tj = 150 °C  
Eoff  
57  
mJ  
per IGBT, λpaste=0.8 W/(mK)  
per IGBT, λpaste=2.5 W/(mK)  
Rth(j-s)  
Rth(j-s)  
0.092  
0.059  
K/W  
K/W  
GD  
© by SEMIKRON  
Rev. 2.0 – 17.11.2021  
1

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