SKiiP 802 GH 061 - 2*259 CTV
Absolute Maximum Ratings
SKiiPPACK
SK integrated intelligent
Power PACK
single phase bridge
SKiiP
Symbol Conditions 1)
Values
2500
Units
V
4)
Visol
AC, 1min
Top ,Tstg
Operating / stor. temperature
-25...+85
°C
IGBT and Inverse Diode
VCES
802 GH 061 - 2*259 CTV
7,9)
600
400
800
V
V
A
°C
A
5)
VCC
IC
Tj
Operating DC link voltage
IGBT
IGBT + Diode
Diode
Preliminary Data
Case S5
3)
-40...+150
800
IF
IFM
IFSM
Diode, tp < 1 ms
Diode, Tj = 150 °C, 10ms; sin
1600
8000
320
A
A
I2t (Diode) Diode, Tj = 150 °C, 10ms
Driver
kAs2
VS1
VS2
fsmax
dV/dt
Stabilized Power Supply
Non-stabilized Power Supply
Switching frequency
18
30
20
75
V
V
kHz
kV/µs
Primary to secondary side
Characteristics
Symbol Conditions 1)
min.
typ.
max.
Units
Features
IGBT11)
V(BR)CES
• Short circuit protection, due to
evaluation of current sensor
signals
Driver without supply
V
mA
mA
≥VCES
−
−
12
−
0,8
−
0,94
2,1
2,6
ICES
VGE = 0,
CE = VCES
Tj = 25 °C
Tj = 125 °C
−
−
−
−
−
−
−
V
• Isolated power supply
• Low thermal impedance
• Optimal thermal management
with integrated heatsink
• Pressure contact technology
with increased power cycling
capability, compact design
• Low stray inductance
• High power, small losses
• Over-temperature protection
VTO
rT
VCesat
VCesat
Tj = 125 °C
Tj = 125 °C
IC = 800A,
IC = 800A,
V
−
−
−
−
−
mΩ
V
V
Tj = 125 °C
Tj = 25 °C
2,60
72/102
Eon + Eoff VCC=300/400V,IC=800A
Tj = 125 °C
mJ
CCHC
LCE
per SkiiP, AC side
Top, Bottom
1,6
7,5
nF
nH
−
−
−
−
Inverse Diode 2)
1)
Theatsink = 25 °C, unless
VF = VEC IF= 800A;
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
1,72
1,75
24
0,78
1,2
V
V
mJ
V
−
−
−
−
−
−
−
−
−
−
otherwise specified
CAL = Controlled Axial Lifetime
VF= VEC
IF= 800A
2)
Eon + Eoff IF= 800A;
Technology (soft and fast)
without driver
Driver input to DC link /
3)
VTO
rT
Tj = 125 °C
Tj = 125 °C
4)
mΩ
AC output to DC link / AC
output to heatsink
with Semikron-DC link (low
inductance)
other heatsinks on request
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
AC connection busbars must be
Thermal Characteristics
10)
Rthjs
Rthjs
Rthsa
per IGBT
per Diode
P16 heatsink; see case S5
0,050
0,094
33
K/W
K/W
K/KW
−
−
−
−
−
−
5)
10)
6,10)
6)
Driver
IS1
IS2
7)
Supply current 15V-supply
Supply current 24V-supply
Interlock-time
210+390*fs /fsmax+1,3*IAC/A
160+290*fs /fsmax+1,0*IAC/A
2,3
mA
mA
µs
8)
tinterlock-driver
SKiiPPACK protection
connected by the user; copper
busbars available on request
options available for driver:
U - DC link voltage sense
F – Fiber optic connector
“s” referenced to temperature
ITRIPSC
ITRIPLG
TTRIP
Short circuit protection
826
A
A
°C
V
9)
Ground fault protection
Over-temp. protection
UDC-protection
115
410
9)
UDCTRIP
10)
Mechanical Data
sensor
M1
DC terminals, SI Units
4
8
6
10
Nm
Nm
−
−
11)
NPT-technology with homo-
M2
AC terminals, SI Units
genous current-distribution
by SEMIKRON
11.01.99