SK3150AF - SK3200AF
SURFACE MOUNT SCHOTTKY BARRIER DIODES
VOLTAGE RANGE: 150-200V
CURRENT: 3.0 A
Features
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Schottky Barrier Chip
Guard Ring Die Construction for
Transient Protection
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High Current Capability
Low Power Loss, High Efficiency
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High Surge Current Capability
For Use in Low Voltage, High Frequency
Inverters, Free Wheeling, and Polarity
Protection Applications
B
C
E
SMAF
Dim Min Max Typ
Mechanical Data
D
A
B
C
D
E
H
L
4.75 4.85
3.68 3.72
4.80
3.70
2.60
1.00
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Case: SMAF,Molded Plastic
H
2.57
2.63
Terminals: Solder Plated, Solderable
L
0.097 1.03
per MIL-STD-750, Method 2026
Polarity:Color band denotes cathode end
Mounting Position:Any
1.38 1.42 1.40
0.13 0.17 0.15
0.63 0.67 0.65
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E
All Dimensions in mm
Weight:0.0018 ounce, 0.064 grams
A
TA = 25ꢀC unless otherwise specified
Maximum Ratings and Electrical Characteristics
For capacitive load, derate current by 20%.
Single phase, half wave, 60Hz, resistive or inductive load.
Symbol
Characteristic
SK3200AF
Unit
SK3150AF
Volts
Volts
Volts
Maximum repetitive peak reverse voltage
Maximum RMS voltage
150
105
150
200
140
200
VRRM
VRMS
VDC
Maximum DC blocking voltage
Maximum average forward rectified current
0.375”(9.5mm) lead length(see fig.1)
Peak forward surge current
I(AV)
3.0
Amps
IFSM
80.0
0.95
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
Amps
VF
IR
Maximum instantaneous forward voltage at 3.0A
Volts
mA
Maximum DC reverse current
at rated DC blocking voltage
TA=25 C
0.2
2.0
TA=100 C
Typical junction capacitance (NOTE 1)
CJ
pF
C/W
C
160
40.0
-65 to +150
Typical thermal resistance (NOTE 2)
Operating junction temperature range
RθJA
TJ,
Storage temperature range
C
TSTG
-65 to +150
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.Thermal resistance from junction to ambient at 0.375”(9.5mm)lead length,P.C.B. mounted
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