SK 151 GB 07F3 T
Absolute Maximum Ratings
Symbol Conditions
Inverter - IGBT
Values
Unit
Tj = 25 °C
VCES
IC
650
145
115
150
450
V
A
A
A
A
V
Ts = 25 °C
Ts = 70 °C
Tj = 175 °C
ICnom
ICRM
VGES
-20 ... 20
SEMITOP® 3
IGBT module
SK 151 GB 07F3 T
Features*
VCC = 400 V
V
V
GE ≤ 15 V
Tj = 150 °C
tpsc
5
µs
°C
CES ≤ 650 V
Tj
-40 ... 175
Inverse - Diode
Tj = 25 °C
VRRM
IF
600
27
21
40
95
V
A
A
A
A
Ts = 25 °C
Ts = 70 °C
Tj = 175 °C
IFRM
IFSM
Tj
10 ms, sin 180°, Tj = 150 °C
• Compact design
-40 ... 175
°C
• One screw mounting module
• Heat transfer and isolation through
direct copper bonded aluminium oxide
ceramic (DBC)
• 650V Fast Trench3 IGBT technology
• CAL diode technology
• Integrated NTC temperature sensor
• UL recognized, file no. E 63 532
Module
It(RMS)
Tstg
∆Tterminal at PCB joint = 30 K, per pin
module without TIM
AC, sinusoidal, t = 1 min
60
-40 ... 125
2500
A
°C
V
Visol
Characteristics
Symbol Conditions
Inverter - IGBT
min.
typ.
max.
Unit
Typical Applications
• Switching (not for linear use)
• Inverter
IC = 150 A
Tj = 25 °C
VCE(sat)
1.85
2.18
2.22
2.55
V
V
• Switched mode power supplies
• UPS
V
GE = 15 V
Tj = 150 °C
chiplevel
Tj = 25 °C
Tj = 150 °C
Tj = 25 °C
Tj = 150 °C
VCE0
rCE
1.10
1.00
5.0
7.9
5.1
1.20
1.10
6.8
9.7
5.6
V
V
mΩ
mΩ
V
mA
nF
nF
nF
nC
Ω
ns
ns
mJ
ns
ns
Remarks
chiplevel
Dynamic measurements set-up:
- IGBT switching on external 150A 600V
Ultrafast diode
VGE = 15 V
chiplevel
- Diode switching on external 20A 600V
Trench3 IGBT
VGE(th)
ICES
Cies
Coes
Cres
QG
RGint
td(on)
tr
Eon
td(off)
tf
Eoff
Rth(j-s)
VGE = VCE, IC = 2.4 mA
VGE = 0 V, VCE = 600 V, Tj = 25 °C
f = 1 MHz
4.2
0.2
9.30
0.35
0.27
1380
1.6
153
130
8.8
VCE = 25 V
f = 1 MHz
f = 1 MHz
V
GE = 0 V
VGE = -15 ... +15 V
Tj = 25 °C
VCC = 300 V
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
Tj = 150 °C
I
C = 150 A
R
R
G on = 15 Ω
G off = 15 Ω
719
43
4
di/dton = 974 A/µs
di/dtoff = 3024 A/µs
V
GE = +15/-15 V
mJ
K/W
per IGBT, λpaste=0.8 W/(mK)
0.41
GB-T
© by SEMIKRON
Rev. 2.0 – 06.08.2021
1