SiSS28DN
Vishay Siliconix
www.vishay.com
N-Channel 25 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
PRODUCT SUMMARY
VDS (V)
RDS(on) () (MAX.)
0.00152 at VGS = 10 V
0.00224 at VGS = 4.5 V
ID (A) a, g Qg (TYP.)
• Optimized Qg, Qgd, and Qgd/Qgs ratio
reduces switching related power loss
60
25
21.8 nC
60
• 100 % Rg and UIS tested
PowerPAK® 1212-8S
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
D
8
D
7
D
D
6
5
APPLICATIONS
D
• Synchronous rectification
• High power density DC/DC
• VRMs and embedded DC/DC
1
S
2
S
G
3
S
• Synchronous buck converter
4
G
1
Top View
• Load switching
Bottom View
• Battery management
S
Ordering Information:
SiSS28DN-T1-GE3 (lead (Pb)-free and halogen-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
25
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
+16, -12
60 g
60 g
41.8 b, c
33.1 b, c
150
T
C = 25 °C
C = 70 °C
T
Continuous Drain Current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
A
Pulsed Drain Current (t = 100 μs)
IDM
IS
TC = 25 °C
41.8
4.3 b, c
Continuous Source-Drain Diode Current
TA = 25 °C
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
IAS
30
L = 0.1 mH
EAS
45
mJ
W
T
C = 25 °C
C = 70 °C
57
T
36
Maximum Power Dissipation
PD
TA = 25 °C
TA = 70 °C
4.8 b, c
3 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient b, f
SYMBOL
RthJA
TYPICAL
MAXIMUM
UNIT
t 10 s
21
26
°C/W
Maximum Junction-to-Case (Drain)
Steady state
RthJC
1.7
2.2
Notes
a. Based on TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 70 °C/W.
g. Package limited.
S16-1282-Rev. A, 27-Jun-16
Document Number: 76552
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000