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SiSS28DN PDF预览

SiSS28DN

更新时间: 2024-11-06 14:55:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 207K
描述
N-Channel 25 V (D-S) MOSFET

SiSS28DN 数据手册

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SiSS28DN  
Vishay Siliconix  
www.vishay.com  
N-Channel 25 V (D-S) MOSFET  
FEATURES  
• TrenchFET® Gen IV power MOSFET  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) () (MAX.)  
0.00152 at VGS = 10 V  
0.00224 at VGS = 4.5 V  
ID (A) a, g Qg (TYP.)  
• Optimized Qg, Qgd, and Qgd/Qgs ratio  
reduces switching related power loss  
60  
25  
21.8 nC  
60  
• 100 % Rg and UIS tested  
PowerPAK® 1212-8S  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
D
8
D
7
D
D
6
5
APPLICATIONS  
D
• Synchronous rectification  
• High power density DC/DC  
• VRMs and embedded DC/DC  
1
S
2
S
G
3
S
• Synchronous buck converter  
4
G
1
Top View  
• Load switching  
Bottom View  
• Battery management  
S
Ordering Information:  
SiSS28DN-T1-GE3 (lead (Pb)-free and halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
25  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
+16, -12  
60 g  
60 g  
41.8 b, c  
33.1 b, c  
150  
T
C = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
Pulsed Drain Current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
41.8  
4.3 b, c  
Continuous Source-Drain Diode Current  
TA = 25 °C  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
IAS  
30  
L = 0.1 mH  
EAS  
45  
mJ  
W
T
C = 25 °C  
C = 70 °C  
57  
T
36  
Maximum Power Dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
4.8 b, c  
3 b, c  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak temperature) d, e  
TJ, Tstg  
-55 to +150  
260  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum Junction-to-Ambient b, f  
SYMBOL  
RthJA  
TYPICAL  
MAXIMUM  
UNIT  
t 10 s  
21  
26  
°C/W  
Maximum Junction-to-Case (Drain)  
Steady state  
RthJC  
1.7  
2.2  
Notes  
a. Based on TC = 25 °C.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 70 °C/W.  
g. Package limited.  
S16-1282-Rev. A, 27-Jun-16  
Document Number: 76552  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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