Datasheet > SiSS28DN

SiSS28DN

更新时间： 2024-11-07 14:55:59

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	207K
描述
N-Channel 25 V (D-S) MOSFET

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SiSS28DN 数据手册

SiSS28DN

Vishay Siliconix

www.vishay.com

N-Channel 25 V (D-S) MOSFET

FEATURES

• TrenchFET^®Gen IV power MOSFET

PRODUCT SUMMARY

V_DS(V)

R_DS(on)() (MAX.)

0.00152 at V_GS= 10 V

0.00224 at V_GS= 4.5 V

I_D(A) ^{a, g}Q_g(TYP.)

• Optimized Q_g, Q_gd, and Q_gd/Q_gsratio

reduces switching related power loss

21.8 nC

• 100 % R_gand UIS tested

PowerPAK^®1212-8S

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• Synchronous rectification

• High power density DC/DC

• VRMs and embedded DC/DC

• Synchronous buck converter

Top View

• Load switching

Bottom View

• Battery management

Ordering Information: 

SiSS28DN-T1-GE3 (lead (Pb)-free and halogen-free)

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

+16, -12

60 ^g

41.8 ^{b, c}

33.1 ^{b, c}

150

_C= 25 °C

_C= 70 °C

Continuous Drain Current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

Pulsed Drain Current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

41.8

4.3 ^{b, c}

Continuous Source-Drain Diode Current

T_A= 25 °C

Single Pulse Avalanche Current

Single Pulse Avalanche Energy

I_AS

L = 0.1 mH

E_AS

_C= 25 °C

_C= 70 °C

Maximum Power Dissipation

P_D

T_A= 25 °C

T_A= 70 °C

4.8 ^{b, c}

3 ^{b, c}

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak temperature) ^{d, e}

T_J, T_stg

-55 to +150

260

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum Junction-to-Ambient ^{b, f}

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  10 s

°C/W

Maximum Junction-to-Case (Drain)

Steady state

R_thJC

1.7

2.2

Notes

a. Based on T_C= 25 °C.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 10 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8S is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 70 °C/W.

g. Package limited.

S16-1282-Rev. A, 27-Jun-16

Document Number: 76552

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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