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SIR316DP PDF预览

SIR316DP

更新时间: 2022-10-16 00:00:03
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
13页 506K
描述
N-Channel 25 V (D-S) MOSFET

SIR316DP 数据手册

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New Product  
SiR316DP  
Vishay Siliconix  
N-Channel 25 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a, g  
Definition  
30g  
30g  
TrenchFET® Power MOSFET  
100 % Rg Tested  
100 % UIS Tested  
0.0068 at VGS = 10 V  
0.0093 at VGS = 4.5 V  
25  
7.4 nC  
PowerPAK® SO-8  
Compliant to RoHS Directive 2002/95/EC  
APPLICATIONS  
DC/DC  
- High Side Switch  
S
6.15 mm  
5.15 mm  
D
1
S
2
S
3
G
4
D
8
D
G
7
D
6
D
5
Bottom View  
S
Ordering Information: SiR316DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
Limit  
25  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
30g  
30g  
17.8b, c  
14.3b, c  
50  
30g  
3.7b, c  
20  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current (t = 300 µs)  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
L = 0.1 mH  
TC = 25 °C  
IAS  
Single Pulse Avalanche Current  
Single Pulse Avalanche Energy  
EAS  
mJ  
W
20  
25  
16  
3.9b, c  
2.5b, c  
T
C = 70 °C  
A = 25 °C  
PD  
Maximum Power Dissipation  
T
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
25  
Maximum  
Unit  
t 10 s  
Steady State  
32  
°C/W  
RthJC  
3.9  
5.0  
Notes:  
a. Based on TC = 25 °C.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 s.  
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 80 °C/W.  
g. Package limited.  
Document Number: 67536  
S11-0615-Rev. A, 04-Apr-11  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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