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SIMXRT1RT10201DVL4A PDF预览

SIMXRT1RT10201DVL4A

更新时间: 2024-10-16 02:10:11
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
111页 1264K
描述
i.MX RT1060 Crossover Processors for Industrial Products

SIMXRT1RT10201DVL4A 数据手册

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Document Number: IMXRT1060IEC  
Rev. 0.2, 02/2020  
NXP Semiconductors  
Data Sheet: Technical Data  
MIMXRT1061CVL5A  
MIMXRT1061CVJ5A  
MIMXRT1062CVL5A  
MIMXRT1062CVJ5A  
i.MX RT1060 Crossover  
Processors for Industrial  
Products  
Package Information  
Plastic Package  
196-pin MAPBGA, 10 x 10 mm, 0.65 mm pitch  
196-pin MAPBGA, 12 x 12 mm, 0.8 mm pitch  
Ordering Information  
See Table 1 on page 6  
1 i.MX RT1060 Introduction  
The i.MX RT1060 is a new processor family featuring  
NXP’s advanced implementation of the Arm  
1. i.MX RT1060 Introduction . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6  
2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
3.1. Special signal considerations . . . . . . . . . . . . . . . 17  
3.2. Recommended connections for unused analog  
®
Cortex -M7 core, which operates at speeds up to 528  
MHz to provide high CPU performance and best  
real-time response.  
The i.MX RT1060 processor has 1 MB on-chip RAM.  
512 KB can be flexibly configured as TCM or general  
purpose on-chip RAM, while the other 512 KB is  
general-purpose on-chip RAM. The i.MX RT1060  
integrates advanced power management module with  
DCDC and LDO that reduces complexity of external  
power supply and simplifies power sequencing. The  
i.MX RT1060 also provides various memory interfaces,  
including SDRAM, RAW NAND FLASH, NOR  
FLASH, SD/eMMC, Quad SPI, and a wide range of  
other interfaces for connecting peripherals, such as  
WLAN, Bluetooth™, GPS, displays, and camera  
sensors. The i.MX RT1060 has rich audio and video  
features, including LCD display, basic 2D graphics,  
camera interface, SPDIF, and I2S audio interface. The  
i.MX RT1060 has analog interfaces, such as ADC,  
ACMP, and TSC.  
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20  
4.1. Chip-Level conditions . . . . . . . . . . . . . . . . . . . . . 20  
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 27  
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 38  
4.5. External memory interface . . . . . . . . . . . . . . . . . 43  
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 53  
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56  
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59  
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 66  
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79  
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 81  
5.1. Boot mode configuration pins . . . . . . . . . . . . . . . 81  
5.2. Boot device interface allocation . . . . . . . . . . . . . . 81  
6. Package information and contact assignments . . . . . . . 86  
6.1. 10 x 10 mm package information . . . . . . . . . . . . 86  
6.2. 12 x 12 mm package information . . . . . . . . . . . . 98  
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110  
NXP reserves the right to change the production detail specifications as may be required  
to permit improvements in the design of its products.  

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